公开(公告)号：JP2010080919A

公开(公告)日：2010-04-08

申请号：JP2009156088

申请日：2009-06-30

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BARNES MICHAEL S ,  BLUCK TERRY

IPC: H01L21/3065 ,  C23F4/00 ,  H01L21/677 ,  H01L31/04

CPC classification number: H01L21/67225 ,  H01L21/67155 ,  H01L31/18

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and methods that manufacture patterned layers on a substrate using a detachable mask. SOLUTION: Unlike prior art where the mask is formed directly over the substrate, the mask 110 is formed independently of the substrate 105. During use, the mask 110 is positioned in close proximity or in contact with the substrate 105 so as to expose only portions of the substrate 105 to processing, e.g., deposition, sputtering or etch. Once the processing is completed, the mask 110 is moved away from the substrate 105 and may be discarded or used for another substrate 105. The mask 110 may be cycled for a given number of substrates 105 and then be removed for cleaning or disposal. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种使用可拆卸掩模在衬底上制造图案化层的设备和方法。 解决方案：与掩模直接形成在衬底上的现有技术不同，掩模110独立于衬底105形成。在使用期间，掩模110位于与衬底105紧密接近或接触的位置，以便 仅暴露衬底105的一部分以进行处理，例如沉积，溅射或蚀刻。 一旦处理完成，掩模110被移动离开基板105，并且可以被丢弃或用于另一基板105.掩模110可以循环给定数量的基板105，然后被移除以进行清洁或处置。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009158917A

公开(公告)日：2009-07-16

申请号：JP2008241299

申请日：2008-09-19

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： SAMIR TUGRUL ,  BLUCK TERRY ,  GRIMARD DENNIS

IPC: H01L21/683 ,  B23K26/38 ,  B23Q3/15 ,  H01L21/3065 ,  H02N13/00

CPC classification number: H01L21/6831

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck having surface embossments pattern for effectively balancing a uniform distribution of a backside gas, and gas-phase heat transfer and solid contact heat transfer. SOLUTION: The electrostatic chuck includes an angled conduit, or an angled laser drilled passage, through which a heat transfer gas is provided. A segment of the angled conduit and/or the angled laser drilled passage extends along an axis different from an axis of the electric field generated to hold a substrate to the chuck, thereby minimizing plasma arcing and backside gas ionization. A first plug may be inserted into the conduit, wherein a segment of a first exterior channel thereof extends along an axis different from an axis of the electric field. A first and a second plug may be inserted into a ceramic sleeve which extends through at least one of the dielectric member and the electrode. Finally, the surface of the dielectric member may comprise embossments arranged at radial distances from the center of the dielectric member so as to improve heat transfer and gas distribution. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供具有表面压花图案的静电卡盘，用于有效平衡背侧气体的均匀分布，以及气相热传递和固体接触热传递。 解决方案：静电卡盘包括成角度的导管或倾斜的激光钻孔通道，通过该通道提供传热气体。 成角度的管道和/或成角度的激光钻孔通道的一段沿着不同于将基板保持在卡盘上的电场的轴线不同的轴线延伸，从而最小化等离子体电弧放电和背侧气体电离。 第一塞子可以插入导管中，其中第一外部通道的一段沿着不同于电场的轴线的轴线延伸。 可以将第一和第二插头插入延伸穿过电介质构件和电极中的至少一个的陶瓷套管中。 最后，电介质构件的表面可以包括布置在离电介质构件的中心的径向距离处的凸起，以便改善传热和气体分布。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009071180A

公开(公告)日：2009-04-02

申请号：JP2007239922

申请日：2007-09-14

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  FAIRBAIRN KEVIN P ,  BARNES MICHAEL S ,  LANE CHRISTOPHER T

IPC: H01L21/677

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for conveying and processing substrates inclusive of wafers adapted to allow efficient production at a reasonable cost and also having an improved throughput, as compared to systems in use today. SOLUTION: A key constituent feature is use of a conveying chamber, which feeds substrates into a controlled atmosphere along the sides of processing chambers through a load lock and then along a conveying chamber that performs as a means for carrying the substrates to reach the processing chambers, and subsequently to processing within the processing chambers, releases the substrates to the exterior of the controlled atmosphere. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：与目前使用的系统相比，提供一种用于输送和处理包括晶片的衬底的装置和方法，其适于允许以合理的成本有效地生产并且还具有改善的生产量。 解决方案：一个关键的组成特征是使用输送室，其通过负载锁将基板沿着处理室的侧面输送到受控气氛中，然后沿着作为承载基板达到的装置的输送室 处理室，随后在处理室内进行处理，将基板释放到受控气氛的外部。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013225370A

公开(公告)日：2013-10-31

申请号：JP2013118321

申请日：2013-06-04

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： BARNES MICHAEL S ,  BLUCK TERRY

IPC: G11B5/84 ,  G11B5/855 ,  H01L21/3065

CPC classification number: G11B5/84 ,  G11B5/855 ,  H01J37/3438

Abstract: PROBLEM TO BE SOLVED: To provide a system for etching a patterned media disk.SOLUTION: A movable non-contact electrode is utilized to perform sputter etch. The electrode moves to be nearly but not in contact with the substrate, so as to couple RF energy to a disk 350. The material to be etched may be metal, e.g., Co/Pt/Cr or similar metals. The substrate is held vertically in a carrier 320 and both sides are etched serially. That is, one side is etched in one chamber, and then in the next chamber the second side is etched. An isolation valve is disposed between the two chambers and the disk carrier 320 moves the disk between the chambers. The carrier 320 may be a linear drive carrier, using, e.g., magnetized wheels and linear motors 326.

Abstract translation: 要解决的问题：提供蚀刻图案化介质盘的系统。解决方案：利用可移动非接触电极进行溅射蚀刻。 电极移动到与衬底几乎但不接触，从而将RF能量耦合到盘350.待蚀刻的材料可以是金属，例如Co / Pt / Cr或类似的金属。 衬底垂直地保持在载体320中，并且两侧被连续蚀刻。 也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。 隔离阀设置在两个腔室之间，并且圆盘托架320将圆盘移动到腔室之间。 载体320可以是线性驱动载体，使用例如磁化轮和线性马达326。

公开(公告)号：JP2008027572A

公开(公告)日：2008-02-07

申请号：JP2007207150

申请日：2007-08-08

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： FAIRBAIRN KEVIN P ,  BLUCK TERRY ,  MARION CRAIG

IPC: G11B5/84 ,  C23C14/56 ,  C23C16/458 ,  C23C16/54 ,  H01L21/00

CPC classification number: C23C16/4587 ,  C23C14/568 ,  C23C16/54 ,  G11B5/00 ,  G11B5/8404 ,  H01L21/67161 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276

Abstract: PROBLEM TO BE SOLVED: To provide a system with a small foot print which has many stations and processing substrates such as magnetic disks. SOLUTION: Disk processing and a manufacturing device are described. A processing chamber is laminated on a station and disks move on a disk carrier through a system, wherein the disk carrier is adjustable to take various sizes of disks. The disks enter the system through a loading zone and are then mounted in the disk carriers. The disks are in the carrier and continuously move at a certain level through the processing chambers and then move to another level by a lift or elevator. At another level, the disks continuously move again through the system and are then output at an unloading zone. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供具有许多站台和处理基板（例如磁盘）的小脚印的系统。

解决方案：描述了磁盘处理和制造装置。 处理室层压在站台上，盘通过系统在盘载体上移动，其中盘载体可调节以采取各种尺寸的盘。 磁盘通过装载区进入系统，然后安装在磁盘托架中。 磁盘在载体中，并通过处理室连续地移动到一定水平，然后通过电梯或电梯移动到另一个水平。 在另一个层面上，盘再次通过系统移动，然后在卸载区域输出。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2011091361A

公开(公告)日：2011-05-06

申请号：JP2010149236

申请日：2010-06-30

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  PEDERSON TERRY ,  GRIMARD DENNIS

IPC: H01L21/683 ,  B23Q3/15 ,  H02N13/00

CPC classification number: H01L21/6831

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck assembly capable of reducing formation of plasma in the inside of an electrostatic chuck or its circumference, for example, in an opening penetrating the electrostatic chuck assembly, and a duct or its circumference while supplying a sufficient quantity of heat exchange gas to a substrate. SOLUTION: An isolator for a heat exchange gas conduit of this electrostatic chuck is disclosed. The isolator 300 includes a sleeve 304 and a body 308 arranged in the sleeve 304 for forming an annulus 312 for running the heat exchange gas between the sleeve 304 and itself. The body 308 is arranged in contact with a dielectric pack 111 of the electrostatic chuck, and may be supported in this position by a spring 328. A silicon seal 334 may be provided between the sleeve 304 and the pack 111 to prevent plasma from being formed in the conduit. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够减少静电卡盘或其周边内部的等离子体形成的静电卡盘组件，例如在穿过静电卡盘组件的开口以及导管或其圆周上，同时 向基板供应足够量的热交换气体。 解决方案：公开了一种用于该静电卡盘的热交换气体导管的隔离器。 隔离器300包括套筒304和布置在套筒304中的主体308，用于形成用于在套筒304和本身之间运行热交换气体的环带312。 主体308布置成与静电卡盘的电介质组111接触，并且可以通过弹簧328被支撑在该位置。硅密封件334可以设置在套筒304和包装件111之间，以防止形成等离子体 在导管中。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010199517A

公开(公告)日：2010-09-09

申请号：JP2009046027

申请日：2009-02-27

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： BLUCK TERRY ,  FAIRBAIRN KEVIN P ,  BARNES MICHAEL S ,  LANE CHRISTOPHER T

IPC: H01L21/677 ,  C23C14/56 ,  C23C16/44 ,  H01L21/02 ,  H01L21/203 ,  H01L21/205 ,  H01L21/3065

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for carrying and processing substrates including wafers in a small footprint. SOLUTION: A linear carrying chamber 1232 includes a linear track, a robot arm 1243 or the like mounted on the linear track, and carries substrates linearly along the side of a process chamber 1201 or the like. Also, it allows the substrates to reach the process chamber 1201 or the like through a load lock 1235 and supplies the substrates into a controlled atmosphere along the carrying chamber 1232. Consequently, manufacture can be efficiently performed at a reasonable cost and with improved throughput. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在小占地面积中承载和处理包括晶片的基板的装置和方法。 解决方案：线性承载室1232包括安装在线性轨道上的线性轨道，机器人臂1243等，并且沿着处理室1201等的侧面线性地承载衬底。 此外，它允许衬底通过负载锁1235到达处理室1201等，并且将衬底沿着承载室1232供应到受控气氛中。因此，可以以合理的成本并且具有改善的生产量来有效地进行制造。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009152599A

公开(公告)日：2009-07-09

申请号：JP2008319137

申请日：2008-12-16

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： HUANG JUDY ,  BARNES MICHAEL S ,  BLUCK TERRY

IPC: H01L21/304 ,  C23C16/44 ,  H01L21/205 ,  H01L21/3065

CPC classification number: C23C16/4405 ,  H01J37/32082 ,  H01J37/32192 ,  H01J37/32862

Abstract: PROBLEM TO BE SOLVED: To provide a substrate processing chamber for processing substrates such as semiconductor wafers, flat panel substrates, solar panels, etc., including mechanism for in-situ plasma cleaning.
SOLUTION: The chamber body has at least one plasma source opening provided on its sidewall. A movable substrate holder is situated within the chamber body, the substrate holder is situated at a first position wherein the substrate is positioned below the plasma source opening for in-situ plasma cleaning of the chamber, and a second position wherein the substrate is positioned above the plasma source opening for substrate processing. A plasma energy source is coupled to the plasma source opening.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供用于处理诸如半导体晶片，平板基板，太阳能电池板等基板的基板处理室，包括用于原位等离子体清洗的机构。 解决方案：腔体具有设置在其侧壁上的至少一个等离子体源开口。 可移动衬底保持器位于腔室内，衬底保持器位于第一位置，其中衬底位于等离子体源开口下方，用于腔室的原位等离子体清洗，以及第二位置，其中衬底位于 用于衬底处理的等离子体源开口。 等离子体能源耦合到等离子体源开口。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2011103463A

公开(公告)日：2011-05-26

申请号：JP2010248999

申请日：2010-11-05

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： HOEY GEE SUN ,  BLUCK TERRY ,  VU HOANG HUY ,  RYU JIMIN

IPC: H01L21/677

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method, in which cost and throughput are improved by maintaining a small installation area and controlling each staying time in an individual processing station. SOLUTION: A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers. A four-axis robot arm is disclosed, capable of linear translation, rotation and articulation, and z-motion. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种设备和方法，其中通过维持小的安装面积并且控制每个处理站中的每个停留时间来提高成本和吞吐量。 线性传送室包括直线轨道和机器人手臂，该线性轨道和机器人手臂骑在线性轨道上，以沿着处理室的侧面线性地传送基片，用于通过加载锁定将基底馈送到受控气氛中，然后沿着传送室 到达处理室。 公开了能够进行线性平移，旋转和关节运动以及z运动的四轴机器人臂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010212678A

公开(公告)日：2010-09-24

申请号：JP2010032982

申请日：2010-02-17

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  SAHIBUDEEN HIZAM ,  GRIMARD DENNIS

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H01L21/683 ,  H01L21/68742

Abstract: PROBLEM TO BE SOLVED: To provide a system and method for safely and optimally dechucking a wafer from an electrostatic chuck surface. SOLUTION: The current of a motor 208 used in a lift pin mechanism 210 is monitored by a controller 204, and a dechuck voltage is determined based on the value of the current. The determined dechuck voltage is applied to an electrode of an electrostatic chuck 216 from a voltage source 212 to dechuck a wafer. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于从静电卡盘表面安全和最佳地将晶片脱扣的系统和方法。 解决方案：由提升销机构210使用的电动机208的电流由控制器204监控，并且基于电流的值确定解扣电压。 将确定的解扣电压从电压源212施加到静电卡盘216的电极以使晶片脱扣。 版权所有（C）2010，JPO＆INPIT