公开(公告)号：JPS5796014A

公开(公告)日：1982-06-15

申请号：JP14408781

申请日：1981-09-14

Applicant: IBM

Inventor： JIYON RICHIYAADO SASUKO ,  ROBIN AN UIITAA

IPC: C08L65/00 ,  C08G59/00 ,  C08G59/42 ,  C08G67/04 ,  C08K3/00 ,  C08L63/00 ,  C09J163/00 ,  H01B3/40 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPS5688204A

公开(公告)日：1981-07-17

申请号：JP13887780

申请日：1980-10-06

Applicant: IBM

Inventor： BAANII MINNA ESUKOTSUTO ,  ROBIN AN UIITAA

IPC: H05K3/28 ,  H01B3/04 ,  H01B3/30 ,  H01L21/48 ,  H01L23/15

公开(公告)号：JPS58206005A

公开(公告)日：1983-12-01

申请号：JP5171483

申请日：1983-03-29

Applicant: Ibm

Inventor： ROJIYAA JIEI KURAAKU ,  JIEEMUZU EKONOMII ,  MEARI AN FURANDERA ,  JIYON RICHIYAADO SASUKO ,  ROBIN AN UIITAA

IPC: H01B3/30 ,  C08F38/00 ,  G03F7/025 ,  H01L21/312 ,  H01L23/14 ,  H01L23/498

CPC classification number: G03F7/025 ,  H01L21/312 ,  H01L23/145 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic circuit having an electrically conductive pattern formed on a substrate (1) and having on at least one surface of the substrate a film (5) obtained from a soluble polymerizable oligomer of the formula: wherein M is -C IDENTICAL C-, -C IDENTICAL C-C IDENTICAL C-, -O-, wherein R is an alkyl or aromatic group; wherein A is an aromatic group; wherein x is the number of appendant acetylenic groups and is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.