公开(公告)号：US09484315B2

公开(公告)日：2016-11-01

申请号：US14668994

申请日：2015-03-26

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Po-Chen Lin ,  Jing-Yao Chang

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4801 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/29099

Abstract: A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.

Abstract translation: 芯片结构包括芯片，第一金属层，第二金属层和接合线。 第一金属层设置在芯片上，第一金属层的材料包括镍或镍合金。 第二金属层设置在第一金属层上，第二金属层的材料包括铜，铜合金，铝，铝合金，钯或钯合金。 接合线与第二金属层连接，接合线的材料包括铜或铜合金。

公开(公告)号：US20160163665A1

公开(公告)日：2016-06-09

申请号：US14668994

申请日：2015-03-26

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Po-Chen Lin ,  Jing-Yao Chang

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4801 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/29099

Abstract: A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.

Abstract translation: 芯片结构包括芯片，第一金属层，第二金属层和接合线。 第一金属层设置在芯片上，第一金属层的材料包括镍或镍合金。 第二金属层设置在第一金属层上，第二金属层的材料包括铜，铜合金，铝，铝合金，钯或钯合金。 接合线与第二金属层连接，接合线的材料包括铜或铜合金。