公开(公告)号：US20240220694A1

公开(公告)日：2024-07-04

申请号：US18149158

申请日：2023-01-03

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Che Hung ,  Shih-Hsien Wu ,  Hsu-Wei Liu ,  Tzong-Lin Wu

IPC: G06F30/39

CPC classification number: G06F30/39 ,  G06F2119/06

Abstract: A power design architecture including a power supply circuit, a power wiring, at least one chip, a power ring, and a first reference conductor is provided. The power wiring is connected to the power supply circuit. The power ring is disposed around the chip and electrically connected to the chip and the power wiring. The first reference conductor is electrically connected to the chip. Low self-impedance is maintained at any position of the power ring.