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公开(公告)号:US20230305343A1
公开(公告)日:2023-09-28
申请号:US18164000
申请日:2023-02-03
Applicant: InnoLux Corporation
Inventor: Ting-Wei LIANG , Jiunn-Shyong LIN , I-An YAO , Tzu-Chieh LAI , Chung-Chun CHENG , Shih-Che CHEN
IPC: G02F1/1343 , G02F1/1347 , G02F1/1345 , G02F1/1335
CPC classification number: G02F1/13439 , G02F1/134309 , G02F1/13478 , G02F1/1345 , G02F1/133512
Abstract: An electronic device is provided. The electronic device includes a first panel. The first panel includes a first substrate, a second substrate, a liquid crystal layer, a first transparent electrode, a second transparent electrode, and a first signal line. The second substrate is opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The first transparent electrode is disposed between the first substrate and the liquid crystal layer. The second transparent electrode is disposed between the second substrate and the liquid crystal layer. The first signal line is electrically connected to the first transparent electrode and extending along a first direction. The impedance of the first signal line is less than the impedance of the first transparent electrode.
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公开(公告)号:US20230119959A1
公开(公告)日:2023-04-20
申请号:US17535167
申请日:2021-11-24
Applicant: InnoLux Corporation
Inventor: Chung-Chun CHENG , Kuang-Ming FAN , Yao-Wen HSU
IPC: H01L23/498 , H01L21/48 , H01L23/00
Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.
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公开(公告)号:US20240006295A1
公开(公告)日:2024-01-04
申请号:US18466610
申请日:2023-09-13
Applicant: InnoLux Corporation
Inventor: Chung-Chun CHENG , Kuang-Ming FAN , Yao-Wen HSU
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H05K1/11
CPC classification number: H01L23/49838 , H01L21/4857 , H01L24/20 , H01L24/19 , H05K1/11 , H05K1/0268 , H01L2224/214 , H01L23/49822 , H01L2224/19 , H05K2201/09372 , H05K1/111
Abstract: A manufacturing method of electronic components includes the steps of: providing an insulating layer including a first region and a second region; providing a first metal layer disposed in the first region of the insulating layer; providing a second metal layer disposed on the first metal layer; providing a metal line in the second region of the insulating layer, wherein the metal line is electrically connected to the first metal layer; and removing the metal line to form an electronic component, wherein the electronic component includes the insulating layer; and a first metal bump disposed on the insulating layer and including: the first metal layer disposed on the insulating layer; and the second metal layer disposed on the first metal layer.
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公开(公告)号:US20250068016A1
公开(公告)日:2025-02-27
申请号:US18945981
申请日:2024-11-13
Applicant: InnoLux Corporation
Inventor: Ting-Wei LIANG , Jiunn-Shyong LIN , I-An YAO , Tzu-Chieh LAI , Chung-Chun CHENG , Shih-Che CHEN
IPC: G02F1/1343 , G02F1/1335 , G02F1/1345 , G02F1/1347
Abstract: An electronic device is provided. The electronic device includes a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a plurality of first electrodes disposed between the first substrate and the liquid crystal layer; a plurality of second electrodes disposed between the second substrate and the liquid crystal layer; a first signal line disposed between the first substrate and the liquid crystal layer, and electrically connected to one of the plurality of first electrodes; and a second signal line disposed between the second substrate and the liquid crystal layer, and electrically connected to one of the plurality of second electrodes. The first signal line and the second signal line include a blackened metal.
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公开(公告)号:US20170102816A1
公开(公告)日:2017-04-13
申请号:US15288284
申请日:2016-10-07
Applicant: InnoLux Corporation
Inventor: Huei-Ying CHEN , Jian-Cheng CHEN , Shun-Fu CHIU , Shih-Che CHEN , Chung-Chun CHENG
IPC: G06F3/041
Abstract: A touch substrate and a touch device are disclosed. The touch substrate includes a substrate and a touch electrode structure, which has a first transparent conductive layer and a second transparent conductive layer. The first transparent conductive layer is disposed on the substrate and the second transparent conductive layer is disposed on the first transparent conductive layer. The first transparent conductive layer has a first side surface located at a first side of the first transparent conductive layer, and the second transparent conductive layer has a second side surface located above the first side. The first side surface has a first slope, and the second side surface has a second slope. The absolute value of the first slope is greater than that of the second slope. The light reflection amount of the touch sensing structure is reduced to improve the visibility of the touch substrate and touch device.
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