公开(公告)号：US12062631B2

公开(公告)日：2024-08-13

申请号：US17025181

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Adel A Elsherbini ,  Krishna Bharath ,  Kevin P. O'Brien ,  Kimin Jun ,  Han Wui Then ,  Mohammad Enamul Kabir ,  Gerald S. Pasdast ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Shawna M. Liff

IPC: H01L23/00 ,  H01L25/065 ,  H01L49/02

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/05147 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0801 ,  H01L2224/08145 ,  H01L2224/0903 ,  H01L2224/09055 ,  H01L2224/09505 ,  H01L2224/29186 ,  H01L2224/32145

Abstract: Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.