公开(公告)号：US09591758B2

公开(公告)日：2017-03-07

申请号：US14227805

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Aleksandar Aleks Aleksov ,  Mauro Kobrinsky ,  Johanna Swan ,  Rajendra C. Dias

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/142 ,  H05K1/148 ,  H05K3/4691 ,  H05K2201/10287 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.

Abstract translation: 这里通常讨论的是可以包括用于柔性线接合装置的装置，系统或方法的系统和装置。 根据一个实例，设备可以包括（1）第一刚性电路，其包括靠近第一刚性电路的第一边缘的第一多个接合焊盘，（2）第二刚性电路，其包括接近于第一刚性电路的第二多个接合焊盘 第二刚性电路的第一边缘，与第一刚性电路相邻的第二刚性电路和面向第一刚性电路的第一边缘的第二刚性电路的第一边缘，或（3）第一多个引线接合线， 所述第一多个引线接合线的接合线电和机械地连接到所述第一多个接合焊盘的接合焊盘和所述第二多个接合焊盘的接合焊盘。

公开(公告)号：US09731369B2

公开(公告)日：2017-08-15

申请号：US13801803

申请日：2013-03-13

Applicant: Intel Corporation

Inventor： Ting Zhong ,  Rajashree Raji Baskaran ,  Aleksandar Aleks Aleksov

IPC: B23K35/00 ,  B23K35/22 ,  B23K1/20 ,  B23K35/02 ,  B23K1/00 ,  B23K3/06 ,  B23K3/08 ,  B23K35/24 ,  B23K35/26 ,  B23K35/30 ,  B23K101/42

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/0623 ,  B23K3/08 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42

Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.