公开(公告)号：US10712779B2

公开(公告)日：2020-07-14

申请号：US15529050

申请日：2015-12-07

Applicant: INTEL CORPORATION

Inventor： Anand V. Reddy ,  Guru Prakash ,  Harish Jagadish ,  Arvind Sundaram

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/3212

Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.

公开(公告)号：US20160165751A1

公开(公告)日：2016-06-09

申请号：US14905275

申请日：2014-08-22

Applicant: INTEL CORPORATION

Inventor： Krishnakumar Varadarajan ,  Anand V. Reddy

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20136 ,  G06F1/20 ,  G06F1/206 ,  H05K7/20336

Abstract: Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone.

Abstract translation: 电子设备和系统的分配冷却。 装置的一个实施例包括壳体; 一个或多个组件，包括一个或多个包括活性热元件的组件; 分隔件，其将所述壳体内的区域分隔成第一冷却区域和第二冷却区域，其中所述第一冷却区段为包括有源热元件的所述一个或多个部件提供冷却; 以及位于所述第一冷却区域中的第一风扇，所述第一风扇产生用于在所述第一冷却区域中冷却的气流，以及位于所述第二冷却区域中的第二风扇，以产生用于在所述第二冷却区域中进行冷却的气流。

公开(公告)号：US10165705B2

公开(公告)日：2018-12-25

申请号：US14905275

申请日：2014-08-22

Applicant: Intel Corporation

Inventor： Krishnakumar Varadarajan ,  Anand V. Reddy

IPC: H05K7/20 ,  G06F1/20

Abstract: Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone.

公开(公告)号：US09551177B2

公开(公告)日：2017-01-24

申请号：US14141196

申请日：2013-12-26

Applicant: INTEL CORPORATION

Inventor： Krishnakumar Varadarajan ,  Harish Jagadish ,  Anand V. Reddy ,  Madhukar Patil ,  James Panakkal ,  Guru Prakash

IPC: E05D11/10 ,  G06F1/16

CPC classification number: E05D11/1007 ,  G06F1/1679 ,  G06F1/1681 ,  Y10T16/54025 ,  Y10T29/24

Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.

Abstract translation: 本文描述了与计算设备中的铰链相关的技术。 这些技术可以包括形成轴以便旋转地移动，以及形成由于轴的旋转运动而平滑运动的滑动部件。