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Patent Agency Ranking
公开(公告)号：US12148742B2
公开(公告)日：2024-11-19
申请号：US16816669
申请日：2020-03-12
Applicant: Intel Corporation
Inventor： Thomas Liljeberg , Andrew C. Alduino , Ravindranath Vithal Mahajan , Ling Liao , Kenneth Brown , James Jaussi , Bharadwaj Parthasarathy , Nitin A Deshpande
Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.
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公开(公告)号：US09904027B2
公开(公告)日：2018-02-27
申请号：US15378786
申请日：2016-12-14
Applicant: Intel Corporation
Inventor： Donald L. Faw , Uri V. Cummings , Terrence J. Trausch , Daniel P. Daly , Andrew C. Alduino
CPC classification number: G02B6/4452 , G02B6/3897 , G06F1/183 , H04Q1/09 , H04Q1/13 , H05K7/1487 , H05K7/1489 , H05K7/1492 , Y10T29/49906
Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.
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公开(公告)号：US20210288035A1
公开(公告)日：2021-09-16
申请号：US16816669
申请日：2020-03-12
Applicant: Intel Corporation
Inventor： Thomas Liljeberg , Andrew C. Alduino , Ravindranath Vithal Mahajan , Ling Liao , Kenneth Brown , James Jaussi , Bharadwaj Parthasarathy , Nitin A. Deshpande
IPC: H01L25/16 , H01L23/00 , G02B6/42 , H01L23/367 , H04B10/40
Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.
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公开(公告)号：US10295283B2
公开(公告)日：2019-05-21
申请号：US14974801
申请日：2015-12-18
Applicant: Intel Corporation
Inventor： Michael K. Patterson , Andrew C. Alduino
Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
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公开(公告)号：US20170176118A1
公开(公告)日：2017-06-22
申请号：US14974801
申请日：2015-12-18
Applicant: Intel Corporation
Inventor： Michael K. Patterson , Andrew C. Alduino
IPC: F28F27/00
CPC classification number: F28F27/00 , F28D20/02 , F28D2021/0029 , G02B6/00 , G02B6/4268 , H01L23/34 , H01L23/427 , H01L23/4275 , Y02E60/145
Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
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