公开(公告)号：US20190203370A1

公开(公告)日：2019-07-04

申请号：US15857362

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Joe Walczyk ,  Pooya Tadayon ,  Andrew Hoitink ,  Tanner Schulz

IPC: C25D5/02 ,  C25D17/00 ,  H05K3/18 ,  H05K13/00

CPC classification number: C25D5/026 ,  C25D17/00 ,  H05K3/188 ,  H05K13/0015

Abstract: A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.

公开(公告)号：US11639556B2

公开(公告)日：2023-05-02

申请号：US15857362

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Joe Walczyk ,  Pooya Tadayon ,  Andrew Hoitink ,  Tanner Schulz

IPC: C25D17/00 ,  C25D5/02 ,  H05K13/00 ,  H05K3/18 ,  C25D1/00

Abstract: A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.