公开(公告)号：US20230299040A1

公开(公告)日：2023-09-21

申请号：US17699024

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Jay Prakash Gupta ,  Souvik Ghosh ,  Kimin Jun ,  Bhupendra Kumar ,  Shashi Vyas ,  Anup Pancholi

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/03 ,  H01L24/08 ,  H01L24/05 ,  H01L2224/0345 ,  H01L2224/03849 ,  H01L2224/08147 ,  H01L2224/05687 ,  H01L2224/05147 ,  H01L2224/05666 ,  H01L2224/05187 ,  H01L2224/8009 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80203 ,  H01L2224/8083 ,  H01L2224/80948 ,  H01L2924/35121

Abstract: A microelectronic assembly and a method of forming same. The assembly includes: first and second microelectronic structures; and an interface layer between the two microelectronic structures including dielectric portions in registration with dielectric layers of each of the microelectronic structures, and electrically conductive portions in registration with electrically conductive structures of each of the microelectronic structures, wherein the dielectric portions include an oxide of a metal, and the electrically conductive portions include the metal.