公开(公告)号：US20240310881A1

公开(公告)日：2024-09-19

申请号：US18185505

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Jeffrey Ho ,  Shawn Mceuen ,  Min Suet Lim ,  Yew San Lim ,  Bruce Cheng

IPC: G06F1/16 ,  F16C11/04

CPC classification number: G06F1/1681 ,  F16C11/04 ,  E05D3/02 ,  E05D5/14 ,  E05Y2999/00

Abstract: Hinges for electronic devices are disclosed herein. An example hinge includes a bracket capable of being coupled to a first portion of the electrical device. The bracket has a barrel defining a first opening. The hinge also includes a shaft in the first opening. The shaft is rotatable in the first opening. The hinge further includes a sleeve capable of being inserted into a bore in a second portion of the electronic device. The sleeve defines a second opening to receive a portion of the shaft.