公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

公开(公告)号：US20250096154A1

公开(公告)日：2025-03-20

申请号：US18466844

申请日：2023-09-14

Applicant: Intel Corporation

Inventor： Chin Mian CHOONG ,  Jiun Hann SIR ,  Poh Boon KHOO ,  Juha PAAVOLA

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/552

Abstract: The present disclosure is directed to a stiffener having a first lateral member and a vertical member that form a frame structure that encloses around a package substrate of a semiconductor package, and the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board.

公开(公告)号：US20250008711A1

公开(公告)日：2025-01-02

申请号：US18344934

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha PAAVOLA ,  Curtis KOEPSELL ,  Sami HEINISUO ,  Kari MANSUKOSKI ,  Jeff KU

IPC: H05K9/00 ,  H05K1/02

Abstract: An electronic device and method for assembling an electronic device. The device includes a shielding structure at least partially, laterally surrounding an electrical component on a circuit board. The device further includes a lid affixed to the top of the shielding structure and covering the electrical component, a spring directly or indirectly applying a load force to the electronic component, and a fastener affixing the lid and the spring to the circuit board.

公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.