公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H05K7/14 ,  H01L23/40 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11217934B2

公开(公告)日：2022-01-04

申请号：US16016378

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Ming-Chen Chang ,  Mustafa H. Haswarey ,  Praneetha Kolla ,  Whitten Schulz

IPC: H01R13/44 ,  H01R13/52 ,  H01R43/00 ,  H01R12/70

Abstract: Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H01L23/40 ,  H05K7/14 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11271335B2

公开(公告)日：2022-03-08

申请号：US16017026

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Mustafa H. Haswarey ,  Ming-Chen Chang ,  Divya Swamy Bandaru

IPC: H05K7/14 ,  H05K7/18 ,  H01R12/70 ,  G06F1/20

Abstract: Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

公开(公告)号：US20190393643A1

公开(公告)日：2019-12-26

申请号：US16016378

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Ming-Chen Chang ,  Mustafa H. Haswarey ,  Praneetha Kolla ,  Whitten Schulz

IPC: H01R13/52 ,  H01R12/70 ,  H01R43/00

Abstract: Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.