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公开(公告)号：US20190104643A1
公开(公告)日：2019-04-04
申请号：US15721242
申请日：2017-09-29
Applicant: INTEL CORPORATION
Inventor： Paul Gwin
Abstract: A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.
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公开(公告)号：US20190047696A1
公开(公告)日：2019-02-14
申请号：US15811098
申请日：2017-11-13
Applicant: Intel Corporation
Inventor： Paul Gwin
Abstract: Methods and apparatus to grasp an object with an unmanned aerial vehicle are described herein. An example unmanned aerial vehicle includes a gripper having a claw to grasp onto an object and an active material disposed on the claw. The example unmanned aerial vehicle further includes a material activator to: (1) apply an activation signal to the active material to soften the active material while the claw grasps the object with the active material, and (2) allow the active material to harden in a shape substantially matching a surface of the object.
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公开(公告)号：US09727102B2
公开(公告)日：2017-08-08
申请号：US13937501
申请日：2013-07-09
Applicant: Intel Corporation
Inventor： Paul Gwin , Harish Jagadish , Narasimha Shastri , Madhukar Patil
Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.
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公开(公告)号：US10766617B2
公开(公告)日：2020-09-08
申请号：US15811098
申请日：2017-11-13
Applicant: Intel Corporation
Inventor： Paul Gwin
Abstract: Methods and apparatus to grasp an object with an unmanned aerial vehicle are described herein. An example unmanned aerial vehicle includes a gripper having a claw to grasp onto an object and an active material disposed on the claw. The example unmanned aerial vehicle further includes a material activator to: (1) apply an activation signal to the active material to soften the active material while the claw grasps the object with the active material, and (2) allow the active material to harden in a shape substantially matching a surface of the object.
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Patent Agency Ranking
5.发明申请公开(公告)号：US20190126921A1
公开(公告)日：2019-05-02
申请号：US16228515
申请日：2018-12-20
Applicant: Intel Corporation
Inventor： Paul Gwin , Mark Sprenger
IPC: B60W30/095 , G05D1/00 , B60W40/09 , G06K9/00
Abstract: Apparatuses, storage media and methods associated with computer assisted or autonomous driving (CA/AD), are disclosed herein. In some embodiments, an apparatus includes one or more communication interfaces to receive an intended or projected path of an object proximally moving near the CA/AD vehicle; sensors to collect sensor data associated with stationary or moving objects in a surrounding area of the CA/AD vehicle; and a navigation subsystem to navigate or assist in navigating the CA/AD vehicle to a destination, based at least in part on the sensor data associated with the stationary or moving objects in the surrounding area, and the received intended or projected path of the object proximally moving near the CA/AD vehicle. Other embodiments are also described and claimed.
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公开(公告)号：US12261068B2
公开(公告)日：2025-03-25
申请号：US17974576
申请日：2022-10-27
Applicant: Intel Corporation
Inventor： Peter Davison , Paul Gwin
IPC: H01L21/673
Abstract: There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf 130. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.
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公开(公告)号：US11032944B2
公开(公告)日：2021-06-08
申请号：US15721242
申请日：2017-09-29
Applicant: INTEL CORPORATION
Inventor： Paul Gwin
IPC: H05K7/20 , F28F3/02 , H01L21/48 , H01L23/373 , H01L23/367
Abstract: A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.
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公开(公告)号：US20210120672A1
公开(公告)日：2021-04-22
申请号：US17133836
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： John Hung , Andrew Morning-Smith , Kai-Uwe Schmidt , Paul Gwin , Nan Allison Yao
Abstract: An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.
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公开(公告)号：US20160089855A1
公开(公告)日：2016-03-31
申请号：US14498129
申请日：2014-09-26
Applicant: Intel Corporation
Inventor： Paul Gwin , Mark Sprenger
CPC classification number: B32B7/02 , B29C61/003 , B29C61/10 , B29K2023/06 , B29K2027/06 , B29K2077/00 , B32B27/06 , B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B27/34 , B32B2270/00 , B32B2307/30 , B32B2307/50 , B32B2307/738 , B32B2437/00 , B32B2457/00 , B32B2457/20
Abstract: Particular embodiments described herein provide for a morphing material that may include an outer layer, a polymer layer, and an inner core. The polymer layer can be between the inner core and the outer layer. The inner core can include a shape memory polymer and the shape memory polymer can have a known glass transition temperature. The morphing material can be mechanically deformed to a temporary shape when a temperature of the shape memory polymer is at or above the glass transition temperature.
Abstract translation: 本文描述的特定实施例提供了可以包括外层，聚合物层和内芯的变形材料。 聚合物层可以在内芯和外层之间。 内芯可以包括形状记忆聚合物，并且形状记忆聚合物可以具有已知的玻璃化转变温度。 当形状记忆聚合物的温度处于或高于玻璃化转变温度时，变形材料可以机械地变形成临时形状。
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