公开(公告)号：US20240029539A1

公开(公告)日：2024-01-25

申请号：US18476069

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Viktor Polyanko ,  Vishnu Prasadh Sugumar ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Sandeep Ahuja ,  Tejas Shah

IPC: G08B21/18 ,  H05K7/20

CPC classification number: G08B21/182 ,  H05K7/20263 ,  H05K7/20763 ,  H05K7/20236

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

公开(公告)号：US20250014967A1

公开(公告)日：2025-01-09

申请号：US18893576

申请日：2024-09-23

Applicant: Intel Corporation

Inventor： Kyle Jordan Arrington ,  Prabhakar Subrahmanyam ,  Steven Adam Klein ,  Kelly Porter Lofgreen ,  Joseph Blane Petrini

IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01R12/85 ,  H01R13/52

Abstract: Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

公开(公告)号：US20240126354A1

公开(公告)日：2024-04-18

申请号：US18399224

申请日：2023-12-28

Applicant: Intel Corporation

Inventor： Kunal Shah ,  Prabhakar Subrahmanyam ,  Venkataramani Gopalakrishnan ,  Chuen Ming Tan ,  Venkataramana Kotakonda ,  Mitsu Shah ,  Kannappan Rajaraman ,  Yi Jen Huang ,  Dmitriy Berchanskiy ,  Swathi Nukala

IPC: G06F1/26 ,  G06F1/3203

CPC classification number: G06F1/266 ,  G06F1/3203

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for power budgeting for computer peripherals with electronic devices. An example apparatus to budget power in an electronic device includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to: detect a Type-C event associated with a computer peripheral; write a power level offset based on an assumed power contract for the computer peripheral during debounce time; obtain an actual power contract for the computer peripheral; and adjust the power level offset based on the actual power contract.

公开(公告)号：US20250123887A1

公开(公告)日：2025-04-17

申请号：US18999992

申请日：2024-12-23

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Mark Angus MacDonald ,  Mainak Banga ,  Jeffrey Christopher Sedayao ,  Ying Feng Pang

IPC: G06F9/48 ,  G06F1/20

Abstract: Systems, apparatus, and methods for energy harvesting in data centers are disclosed. An example apparatus includes interface circuitry; machine-readable instructions; and at least one processor circuit to at least one of instantiate or execute the machine-readable instructions to estimate first power consumption values for electronic components of a first rack; estimate second power consumption values for electronic components of a second rack; determine a first selection score for the first rack based on the first power consumption values and a second selection score for the second rack based on the second power consumption values; select a first electronic component of the first rack or a second electronic component of the second rack to receive a workload based on the first selection score and the second selection score; and cause the selected one of the first electronic component or the second electronic component to perform the workload.

公开(公告)号：US12213288B2

公开(公告)日：2025-01-28

申请号：US17134368

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy ,  Victor Polyanko ,  Ying-Feng Pang ,  Yi Xia ,  Pooya Tadayon ,  Muhammad Ahmad ,  Rahima K. Mohammed

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

公开(公告)号：US20240276675A1

公开(公告)日：2024-08-15

申请号：US18605305

申请日：2024-03-14

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Vishnu Prasadh Sugumar ,  Patrick L. Connor ,  Ying Feng Pang ,  Mark Lawrence Bianco

IPC: H05K7/20 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20

CPC classification number: H05K7/20272 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20 ,  H05K7/20281

Abstract: Systems, apparatus, articles of manufacture, and methods to mitigate hotspots in integrated circuit packages using gimballing nozzles and jet vectoring impingement are disclosed. An apparatus includes an array of nozzles to direct a cooling fluid toward an integrated circuit package. The array of nozzles includes a first nozzle and a second nozzle. The apparatus further includes a plate to carry the array of nozzles. The first nozzle is selectively moveable relative to the integrated circuit package and relative to the second nozzle. Movement of the first nozzle relative to the integrated circuit package including rotational movement and translational movement.

公开(公告)号：US11917790B2

公开(公告)日：2024-02-27

申请号：US16859202

申请日：2020-04-27

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

公开(公告)号：US10930575B2

公开(公告)日：2021-02-23

申请号：US16337883

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tong W. Chao ,  Stephanie L. Seaman ,  Ridvan A. Sahan ,  Ying-Feng Pang

IPC: H01L23/36 ,  H05K7/20 ,  H01L23/427 ,  H01L23/467

Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.

公开(公告)号：US20250053221A1

公开(公告)日：2025-02-13

申请号：US18933804

申请日：2024-10-31

Applicant: Intel Corporation

Inventor： Tarakesava Reddy Koki ,  Prabhakar Subrahmanyam ,  Zhongsheng Wang ,  Feroze Khan ,  Phani Alaparthi ,  Shreedhar Shahapur ,  Venkata Mahesh Gunnam ,  Krishnendu Saha

IPC: G06F1/3231

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to perform power-saving based on user presence, including a network interface to communicate with a cloud device, user presence detector circuitry to determine if a user is present or not present; workload distributor circuitry to distribute an AI workload to either first AI inference circuitry or second AI inference circuitry; and power circuitry to charge a battery at either a first charge level or a second charge level.

公开(公告)号：US20230422389A1

公开(公告)日：2023-12-28

申请号：US18344308

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tejas J. Shah ,  Yi Xia ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Vishnu Prasadh Sugumar ,  Vikas Kundapura Rao ,  Srinivasa Rao Damaraju ,  Ridvan Amir Sahan ,  Emad Shehadeh Al-Momani ,  Rahima Khatun Mohammed ,  Mirui Wang ,  Devdatta Prakash Kulkarni

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K1/0271 ,  H05K2201/064

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.