公开(公告)号：US20250071924A1

公开(公告)日：2025-02-27

申请号：US18940819

申请日：2024-11-07

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Xiang Li ,  George Vergis ,  Ralph Miele ,  Sanjoy Saha ,  Jeffory Smalley

IPC: H05K7/14

Abstract: Methods and apparatus relating to tall Dual Inline Memory Module (DIMM) structural retention are described. In one embodiment, a Dual In-Line Memory Module (DIMM) retention frame is coupled to a top portion of a tall (e.g., “two unit” or taller) DIMM. A plurality of fasteners physically attach the DIMM retention frame to a Printed Circuit Board (PCB). The DIMM retention frame reduces movement of the tall DIMM. Other embodiments are also claimed and disclosed.

公开(公告)号：US20230031457A1

公开(公告)日：2023-02-02

申请号：US17957436

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Phil Geng ,  Ralph Miele ,  Christopher Gonzalez ,  Timothy Gates ,  Sanjoy Saha ,  Ashish Gupta ,  Sandeep Ahuja

IPC: B21C37/16

Abstract: Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

公开(公告)号：US20230038805A1

公开(公告)日：2023-02-09

申请号：US17956624

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Ralph Miele ,  Sandeep Ahuja ,  Jeffory Smalley

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/40

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

公开(公告)号：US09348363B2

公开(公告)日：2016-05-24

申请号：US14142826

申请日：2013-12-28

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell Aoki ,  Anthony Valpiani ,  Ralph Miele

IPC: G06F1/16 ,  F16L3/00 ,  A47F5/00

CPC classification number: G06F1/1624 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1633 ,  G06F1/1654 ,  G06F1/1656

Abstract: A computer assembly comprising a computer assembly base for the computer assembly, a rotatable display screen support coupled to the computer assembly base configured to receive a display screen and an base stabilizer of the computer assembly base configured to extend from a back side of the computer assembly base, wherein upon extension is configured to provide counterbalance support to the computer assembly base to inhibit tipping.

Abstract translation: 一种计算机组件，包括用于计算机组件的计算机组件基座，可旋转的显示屏幕支撑件，其联接到被配置为接收显示屏幕的计算机组件基座和计算机组件基座的基座稳定器， 底座，其中在延伸部被构造成为计算机组件基座提供平衡支撑以抑制倾翻。

公开(公告)号：US09807285B2

公开(公告)日：2017-10-31

申请号：US14668675

申请日：2015-03-25

Applicant: INTEL CORPORATION

Inventor： Amin Godil ,  Shantanu D. Kulkarni ,  Ralph Miele ,  Andrew Larson

IPC: H05K7/20 ,  H04N5/225 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473

CPC classification number: H04N5/2252 ,  B23P15/26 ,  G06F1/20

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to thermally couple a device comprising one or more cameras and circuitry with a housing to house the device, receive thermal energy generated by at least one of the one or more cameras and the circuitry. Further, embodiments may include transferring the thermal energy absorbed from a surface of the device to a surface of the housing and absorbing movement of the housing such that the movement of the housing does not cause substantial movement of the device.

公开(公告)号：US20150198980A1

公开(公告)日：2015-07-16

申请号：US14126277

申请日：2013-07-30

Applicant: INTEL CORPORATION

Inventor： Russell Aoki ,  Ralph Miele ,  Luke Schwartzel

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G06F1/1616 ,  G06F1/1669 ,  G06F1/1681

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion (e.g., having about the same length and width as the display portion). The keyboard portion can include a cradle dock that allows the keyboard portion to be removably connected to the display portion in a first configuration. A viewing angle of the display portion can be changed when the cradle dock is rotated about an axis of rotation on the keyboard.

Abstract translation: 本文描述的特定实施例提供了一种电子设备，其可以包括耦合到多个电子部件（其包括任何类型的部件，元件，电路等）的电路板。 电子设备的一个具体实施例可以包括显示部分和键盘部分（例如，具有与显示部分大致相同的长度和宽度）。 键盘部分可以包括支架底座，其允许键盘部分以第一配置可移除地连接到显示部分。 当托架对接座绕着键盘上的旋转轴线旋转时，可以改变显示部分的视角。

公开(公告)号：US20250055217A1

公开(公告)日：2025-02-13

申请号：US18929426

申请日：2024-10-28

Applicant: Intel Corporation

Inventor： Min Pei ,  Lejie Liu ,  Ralph Miele ,  Phil Geng ,  Steven Klein

IPC: H01R13/24 ,  H01R12/71

Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.

公开(公告)号：US20230022058A1

公开(公告)日：2023-01-26

申请号：US17956540

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  Ralph Miele ,  David Shia

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00

Abstract: Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.

公开(公告)号：US20230014898A1

公开(公告)日：2023-01-19

申请号：US17955210

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Phil Geng ,  Jordan Johnson ,  Mengqi Liu ,  Ralph Miele ,  Min Pei

IPC: H01R12/70 ,  H01R12/82 ,  H01R43/26 ,  H05K7/14

Abstract: Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.