公开(公告)号：US20220390654A1

公开(公告)日：2022-12-08

申请号：US17561781

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Israel Petronius ,  Harel Frish ,  Randal S. Appleton ,  Ron Friedman ,  Kenneth C. Johnson

IPC: G02B5/18

Abstract: Technologies for silicon diffraction gratings are disclosed. In some embodiments, grating lines of the diffraction gratings may have several sub-lines that make up each grating line of the diffraction grating. The sub-lines may be sub-wavelength features. In some embodiments, several silicon diffraction gratings may be made from a wafer, such as a wafer with a diameter of 300 millimeters. The wafer may be etched precisely across the entire wafer, leading to a high yield of the diffraction gratings.

公开(公告)号：US20230204877A1

公开(公告)日：2023-06-29

申请号：US17561694

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： John M. Heck ,  Haisheng Rong ,  Harel Frish ,  Ankur Agrawal ,  Boping Xie ,  Randal S. Appleton ,  Hari Mahalingam ,  Alexander Krichevsky ,  Pooya Tadayon ,  Ling Liao ,  Eric J. M. Moret

IPC: G02B6/42

CPC classification number: G02B6/4207 ,  G02B6/4214 ,  G02B6/428

Abstract: Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.