公开(公告)号：US20250062207A1

公开(公告)日：2025-02-20

申请号：US18933879

申请日：2024-10-31

Applicant: Intel Corporation

Inventor： Srinivas Venkata Ramanuja Pietambaram ,  Tarek Adly Ibrahim ,  Ravindra Vijay Tanikella

IPC: H01L23/498 ,  H01L23/15

Abstract: Methods and apparatus to reduce cracking in glass cores are disclosed. An example apparatus includes a package substrate comprising a glass core having an opening extending between first and second surfaces of the glass core, the first surface opposite the second surface, and a conductive material, a first portion of the conductive material within the opening, a second portion of the conductive material protruding beyond the first surface of the glass core, a first surface of the first portion in continuity with a second surface of the second portion.

公开(公告)号：US20210391264A1

公开(公告)日：2021-12-16

申请号：US16902959

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Bai Nie ,  Kristof Kuwawi Darmawikarta ,  Srinivas V. Pietambaram ,  Haobo Chen ,  Gang Duan ,  Jason M. Gamba ,  Omkar G. Karhade ,  Nitin A. Deshpande ,  Tarek A. Ibrahim ,  Rahul N. Manepalli ,  Deepak Vasant Kulkarni ,  Ravindra Vijay Tanikella

IPC: H01L23/538 ,  H01L21/48

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.