公开(公告)号：US20250048596A1

公开(公告)日：2025-02-06

申请号：US18919968

申请日：2024-10-18

Applicant: Intel Corporation

Inventor： Baomin Liu ,  Rob Sims ,  Kannan G. Raja ,  Linden H. Mcclure ,  Gopinath Kandasamy

IPC: H05K7/20 ,  G06F1/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

公开(公告)号：US20240241559A1

公开(公告)日：2024-07-18

申请号：US18619538

申请日：2024-03-28

Applicant: Intel Corporation

Inventor： Rob Sims ,  Deepak Ganapathy ,  Sivasankara Reddy Juturu ,  Sudheer Nair

IPC: G06F1/28 ,  G06F1/3206

CPC classification number: G06F1/28 ,  G06F1/3206

Abstract: Techniques are described for incorporating telemetry related to power source loading and the frequency of power-control events as part of a power balancing algorithm to control an electronic devices' power budgeting among devices sharing a common power source. The techniques utilize telemetry and control loop algorithms to dynamically balance the power between two or more electronic components, which may include a CPU and a GPU. The techniques as described herein function to monitor power source loading as well as the frequency of a predetermined set of events, which may include performance and/or power control events. Based on this information, the power budgets of the devices may be dynamically adjusted up or down to maximize performance, in contrast with the conventional usage of artificial static performance caps.