公开(公告)号：US20240395567A1

公开(公告)日：2024-11-28

申请号：US18323521

申请日：2023-05-25

Applicant: Intel Corporation

Inventor： Jonas G. Croissant ,  Yiqun Bai ,  Dingying Xu ,  Xavier F. Brun ,  Timothy Gosselin ,  Ye Seul Nam ,  Gustavo Arturo Beltran ,  Roberto Serna ,  Jesus S. Nieto Pescador ,  Aris Mercado Orbase

IPC: H01L21/56 ,  G02B6/122 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: Integrated circuit (IC) packages with pre-applied underfill in select areas, and methods of forming the same, are disclosed herein. In one example, an IC package includes a package substrate, a first IC die electrically coupled to the package substrate, a second IC die electrically coupled to the first IC die, and a thermoset adhesive that partially fills an area between the first IC die and the second IC die.