公开(公告)号：US20030103337A1

公开(公告)日：2003-06-05

申请号：US10004693

申请日：2001-12-05

Applicant: Intel Corporation

Inventor： Scott Dixon ,  George Hsieh ,  Terrance J. Dishongh

IPC: H05K005/06 ,  H05K005/00 ,  H05K005/04

CPC classification number: H05K3/301 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly includes a substrate with mounting apertures. A frame is disposed through the apertures, optionally in a non-core area of the substrate, where a chassis at least partially encompasses a portion of the substrate. A component is coupled with the frame, and the frame is coupled with the chassis.

Abstract translation: 组件包括具有安装孔的基板。 一个框架设置成穿过该孔，可选地位于基底的非芯区域中，其中底架至少部分地包围基底的一部分。 组件与框架相连，框架与底盘相连。

公开(公告)号：US20020108778A1

公开(公告)日：2002-08-15

申请号：US09732115

申请日：2000-12-07

Applicant: Intel Corporation

Inventor： Terrance J. Dishongh ,  James D. Jackson

IPC: H05K007/06 ,  H05K009/00

CPC classification number: H05K1/024 ,  H05K1/0216 ,  H05K1/095 ,  H05K1/112 ,  H05K1/116 ,  H05K1/167 ,  H05K3/06 ,  H05K3/108 ,  H05K3/249 ,  H05K3/429 ,  H05K2201/035

Abstract: A printed circuit board (PCB) includes metallization portions that are enshrouded with a carbon-based cladding. The carbon-based cladding reduces noise coupling between, for example, signal lines within the metallization pattern. In addition, in at least one embodiment, the carbon-based cladding is used to implement one or more electrical resistors (e.g., pull-up and/or pull-down resistors) within the PCB. The carbon-based cladding can also be used to decrease the propagation delay of the signal lines of the PCB.

Abstract translation: 印刷电路板（PCB）包括被覆盖有碳基包层的金属化部分。 碳基包层减少例如金属化图案内的信号线之间的噪声耦合。 此外，在至少一个实施例中，碳基包层用于在PCB内部实现一个或多个电阻（例如上拉和/或下拉电阻）。 碳基包层也可以用于减小PCB的信号线的传播延迟。

公开(公告)号：US20040131824A1

公开(公告)日：2004-07-08

申请号：US10742024

申请日：2003-12-17

Applicant: Intel Corporation

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

IPC: B32B005/12

CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中尤其重要。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。

公开(公告)号：US20040005736A1

公开(公告)日：2004-01-08

申请号：US10187513

申请日：2002-07-02

Applicant: Intel Corporation

Inventor： Damion T. Searls ,  Terrance J. Dishongh ,  James Daniel Jackson

IPC: H01L021/44 ,  H01L023/34

CPC classification number: H01L23/433 ,  B82Y10/00 ,  H01L23/373 ,  H01L2924/0002 ,  Y10S977/833 ,  H01L2924/00

Abstract: An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.

Abstract translation: 在说明书和附图中描述和示出的本发明的实施例是用于在模具和热管理辅助器之间的热界面层中使用碳纳米管促进半导体管芯的冷却和接地的方法和封装。 所公开的实施例具有碳纳米管的定位和尺寸以利用其高的热和电导率来促进热和电流流向热管理辅助装置。 所公开的一个实施例在施加之前碳纳米管与糊状基质混合。 另一个公开的实施例具有在半导体管芯的表面上生长的碳纳米管。

公开(公告)号：US20020151110A1

公开(公告)日：2002-10-17

申请号：US10163823

申请日：2002-06-04

Applicant: Intel Corporation

Inventor： Terrance J. Dishongh ,  Paul W. Churilla ,  David H. Pullen

IPC: H01L021/44 ,  H01L021/48 ,  H01L023/10 ,  H01L023/34

CPC classification number: H01L23/3736 ,  H01L21/50 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/16152

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract translation: 根据本发明的一个方面，提供一种构建电子组件的方法。 电子组件由包括封装衬底和安装在封装衬底上的半导体芯片，导热构件和包括铟的物质的半导体封装构成。 该方法包括使导热构件和半导体封装相对于彼此以选定的取向固定，其中导热构件在半导体芯片的与封装衬底相对的一侧上，并且物质位于半导体芯片与至少一部分之间 的导热构件。 物质在一侧热耦合到半导体芯片，并且在相对侧热耦合到导热部件的部分。

公开(公告)号：US20020076522A1

公开(公告)日：2002-06-20

申请号：US09737213

申请日：2000-12-14

Applicant: Intel Corporation

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

IPC: B32B005/12 ,  B29B007/00

CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中是特别重要的。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。