公开(公告)号：US20220308294A1

公开(公告)日：2022-09-29

申请号：US17214035

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Wesley MORGAN ,  Srikant NEKKANTY ,  Todd R. COONS ,  Gregorio R. MURTAGIAN ,  Xiaoqian LI ,  Nitin DESHPANDE ,  Divya PRATAP

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

公开(公告)号：US20230314733A1

公开(公告)日：2023-10-05

申请号：US17710669

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Eric MORET ,  Paul DIGLIO ,  Wesley MORGAN

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4257

Abstract: Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.

公开(公告)号：US20220413240A1

公开(公告)日：2022-12-29

申请号：US17357941

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Srikant NEKKANTY ,  Pooya TADAYON ,  Wesley MORGAN ,  Tarek A. IBRAHIM ,  Sai VADLAMANI

IPC: G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a cavity created in a package substrate, where the surface of the substrate at the bottom of the cavity, or alignment features at the surface of the substrate at the bottom of the cavity are used to accurately align a lens of a FAU to a lens of a PIC. In embodiments, the surface of the substrate at the bottom of the cavity has additional standoff pedestal features to aid in height tolerance control of the FAU to properly align the FAU lens when attached. Other embodiments may be described and/or claimed.

公开(公告)号：US20240111098A1

公开(公告)日：2024-04-04

申请号：US18488074

申请日：2023-10-17

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20220308293A1

公开(公告)日：2022-09-29

申请号：US17213131

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Wesley MORGAN ,  Nitin DESHPANDE ,  Divya PRATAP

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

公开(公告)号：US20220011517A1

公开(公告)日：2022-01-13

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.