公开(公告)号：US20220353991A1

公开(公告)日：2022-11-03

申请号：US17866775

申请日：2022-07-18

Applicant: Intel Corporation

Inventor： Xiang Li ,  Konika Ganguly ,  George Vergis ,  Stephen Christianson ,  Xiaopeng Dong

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14

Abstract: An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

公开(公告)号：US20220217846A1

公开(公告)日：2022-07-07

申请号：US17700972

申请日：2022-03-22

Applicant: Intel Corporation

Inventor： Xiang Li ,  Konika Ganguly ,  George Vergis ,  Stephen Christianson ,  Xiaopeng Dong ,  Landon Hanks

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

Abstract: An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.