公开(公告)号：US11581271B2

公开(公告)日：2023-02-14

申请号：US16353164

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Rahul Jain ,  Kyu-Oh Lee ,  Islam A. Salama ,  Amruthavalli P. Alur ,  Wei-Lun K. Jen ,  Yongki Min ,  Sheng C. Li

IPC: H01L23/64 ,  H01L23/498 ,  H01L49/02 ,  H01L23/538

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.

公开(公告)号：US11335616B2

公开(公告)日：2022-05-17

申请号：US16498775

申请日：2017-04-28

Applicant: Intel Corporation

Inventor： Malavarayan Sankarasubramanian ,  Yongki Min ,  Ashay A. Dani ,  Kaladhar Radhakrishnan

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/522

Abstract: A semiconductor package may include a composite magnetic inductor that is formed integral with the semiconductor substrate. The composite magnetic inductor may include a composite magnetic resin layer and a plurality of conductive layers arranged such that the composite magnetic resin layer is interleaved between successive conductive layers. The resultant composite magnetic inductor may be disposed between dielectric layers. A core layer may be disposed proximate the composite magnetic inductor. A build-up layer may be disposed proximate the core layer or proximate the composite magnetic inductor in a coreless semiconductor substrate. A semiconductor die may couple to the build-up layer. The composite magnetic inductor beneficially provides a greater inductance than external inductors coupled to the semiconductor package.

公开(公告)号：US20180182718A1

公开(公告)日：2018-06-28

申请号：US15392145

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Kedar Dhane ,  Yongki Min ,  William J. Lambert

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L23/3142 ,  H01L23/49811 ,  H01L25/0655 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/181

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a stiffener on a substrate, wherein a first section of the stiffener and a second section of the stiffener are on opposite sides of an opening. At least one component may be attached on the substrate within the opening, wherein the at least one component is disposed between the first section of the stiffener and the second section of the stiffener, and wherein the stiffener comprises a grounding structure disposed on the substrate.

公开(公告)号：US20210098326A1

公开(公告)日：2021-04-01

申请号：US16498775

申请日：2017-04-28

Applicant: Intel Corporation

Inventor： Malavarayan Sankarasubramanian ,  Yongki Min ,  Ashay A. Dani ,  Kaladhar Radhakrishnan

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/522

Abstract: A semiconductor package may include a composite magnetic inductor that is formed integral with the semiconductor substrate. The composite magnetic inductor may include a composite magnetic resin layer and a plurality of conductive layers arranged such that the composite magnetic resin layer is interleaved between successive conductive layers. The resultant composite magnetic inductor may be disposed between dielectric layers. A core layer may be disposed proximate the composite magnetic inductor. A build-up layer may be disposed proximate the core layer or proximate the composite magnetic inductor in a coreless semiconductor substrate. semiconductor die may couple to the build-up layer. The composite magnetic inductor beneficially provides a greater inductance than external inductors coupled to the semiconductor package.

公开(公告)号：US10741536B2

公开(公告)日：2020-08-11

申请号：US16426939

申请日：2019-05-30

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01F17/00 ,  H01L23/64 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US20190279973A1

公开(公告)日：2019-09-12

申请号：US16426939

申请日：2019-05-30

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadla ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L25/16 ,  H01L23/64 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01F17/00 ,  H01L23/00

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material: a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US10340260B2

公开(公告)日：2019-07-02

申请号：US15911958

申请日：2018-03-05

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01F17/00 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/64

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US10157860B2

公开(公告)日：2018-12-18

申请号：US15392145

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Kedar Dhane ,  Yongki Min ,  William J. Lambert

IPC: H01L21/00 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a stiffener on a substrate, wherein a first section of the stiffener and a second section of the stiffener are on opposite sides of an opening. At least one component may be attached on the substrate within the opening, wherein the at least one component is disposed between the first section of the stiffener and the second section of the stiffener, and wherein the stiffener comprises a grounding structure disposed on the substrate.

公开(公告)号：US20180197845A1

公开(公告)日：2018-07-12

申请号：US15911958

申请日：2018-03-05

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L25/065 ,  H01F17/00 ,  H01L23/498 ,  H01L23/522 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01F17/00 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/06 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16265 ,  H01L2924/1427 ,  H01L2924/143 ,  H01L2924/19011 ,  H01L2924/19042

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

公开(公告)号：US09911723B2

公开(公告)日：2018-03-06

申请号：US14974978

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065 ,  H01L25/16 ,  H01F17/00

CPC classification number: H01L25/18 ,  H01F17/00 ,  H01F17/0006 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L24/06 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16265 ,  H01L2924/1427 ,  H01L2924/143 ,  H01L2924/19011 ,  H01L2924/19042

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.