公开(公告)号：US20250004225A1

公开(公告)日：2025-01-02

申请号：US18345106

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Mohanraj Prabhugoud ,  David Shia ,  Tarek A. Ibrahim ,  Yuxin Fang

IPC: G02B6/42

Abstract: Technologies for substrate features for a pluggable optical connectors in an integrated circuit package are disclosed. In the illustrative embodiment, a substrate includes a cavity cut through a substrate of the integrated circuit package. Sidewalls of the cavity establish coarse lateral alignment features for an optical plug. The optical plug and optical socket include additional alignment features to more precisely align optical fibers in the optical plug to an optical interposer mounted on the substrate. The cavity cut through the substrate may also include indents that can mate with protrusions of the optical plug to retain the optical plug. The optical interposer may be mounted on a recessed shelf in the substrate.

公开(公告)号：US20240421144A1

公开(公告)日：2024-12-19

申请号：US18333860

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Chun-Hao Lin ,  Teng Sun ,  Yuxin Fang

IPC: H01L27/01 ,  H01G4/33

Abstract: Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic substrate with an in situ capacitor, the capacitor may include a first conductive layer having first microstructures at a first surface, a second conductive layer on the first conductive layer and having second microstructures at a second surface, where the second microstructures vertically interlock with the first microstructures, and a high-k dielectric material between the first microstructures and the second microstructures.