公开(公告)号：US20190267312A1

公开(公告)日：2019-08-29

申请号：US16349359

申请日：2016-12-29

Applicant: Intel IP Corporation

Inventor： Sonja Koller ,  Georgg Seidemann ,  Reinhard Mahnkopf ,  Bernd Waidhas

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L23/367 ,  H01L23/373

Abstract: A system-in-package apparatus includes a square wave lead frame that provides a recess for a first semiconductive device as well as a feature for a second device. The system-in-package apparatus includes a printed wiling board that is wrapped onto the lead frame after a manner to enclose the first semiconductive device into the recess.