公开(公告)号：US20190393125A1

公开(公告)日：2019-12-26

申请号：US16015334

申请日：2018-06-22

Applicant: Intel IP Corporation

Inventor： Sonja Koller ,  Vishnu Prasad ,  Georg Seidemann

IPC: H01L23/367 ,  H01L23/31 ,  H01L21/56

Abstract: Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a periphery of the IC package. In some embodiments, thermal contacts are such that at least a portion of a heat exchanger is to be attached on the side of the IC package. In some embodiments, thermal contacts may be provided within a recessed portion at the periphery of the IC package. Providing a thermal contact at a periphery of an IC package may enable improved cooling options, especially for systems where there is no or limited space for providing conventional heat exchangers on the top of the package.

公开(公告)号：US12249553B2

公开(公告)日：2025-03-11

申请号：US16015334

申请日：2018-06-22

Applicant: Intel IP Corporation

Inventor： Sonja Koller ,  Vishnu Prasad ,  Georg Seidemann

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31

Abstract: Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a periphery of the IC package. In some embodiments, thermal contacts are such that at least a portion of a heat exchanger is to be attached on the side of the IC package. In some embodiments, thermal contacts may be provided within a recessed portion at the periphery of the IC package. Providing a thermal contact at a periphery of an IC package may enable improved cooling options, especially for systems where there is no or limited space for providing conventional heat exchangers on the top of the package.

公开(公告)号：US10091866B2

公开(公告)日：2018-10-02

申请号：US15386905

申请日：2016-12-21

Applicant: Intel IP Corporation

Inventor： Sonja Koller ,  Georg Seidemann ,  Vishnu Prasad

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  H05K9/00 ,  G06F1/20

Abstract: Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components and the device skin, the switchable heat path configured to be switched between an on state and an off state, the switchable heat path configured to conduct a first amount of heat from the components to the device skin when in the on state and configured to conduct a second, lesser amount of heat from the components to the device skin when in an off state.