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    Resistive-switching nonvolatile memory elements
    1.
    发明授权
    Resistive-switching nonvolatile memory elements 有权
    电阻式开关非易失性存储元件

    公开(公告)号：US08599603B2

    公开(公告)日：2013-12-03

    申请号：US13829378

    申请日：2013-03-14

    Applicant: Intermolecular Inc.

    Inventor： Pragati Kumar ,  Sean Barstow ,  Tony P. Chiang ,  Sandra G Malhotra

    IPC: G11C11/00

    CPC classification number: H01L45/1253 ,  G11C13/0007 ,  G11C13/003 ,  G11C2213/32 ,  G11C2213/51 ,  G11C2213/52 ,  G11C2213/56 ,  G11C2213/71 ,  G11C2213/72 ,  G11C2213/74 ,  G11C2213/76 ,  G11C2213/79 ,  H01L27/2409 ,  H01L27/2463 ,  H01L29/861 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/146 ,  H01L45/1608 ,  H01L45/165

    Abstract: Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed in one or more layers on an integrated circuit. Each memory element may have a first conductive layer, a metal oxide layer, and a second conductive layer. Electrical devices such as diodes may be coupled in series with the memory elements. The first conductive layer may be formed from a metal nitride. The metal oxide layer may contain the same metal as the first conductive layer. The metal oxide may form an ohmic contact or a Schottky contact with the first conductive layer. The second conductive layer may form an ohmic contact or Schottky contact with the metal oxide layer. The first conductive layer, the metal oxide layer, and the second conductive layer may include sublayers. The second conductive layer may include an adhesion or barrier layer and a workfunction control layer.

    Abstract translation: 提供具有电阻开关金属氧化物的非易失性存储元件。 非易失性存储元件可以形成在集成电路上的一个或多个层中。 每个存储元件可以具有第一导电层，金属氧化物层和第二导电层。 诸如二极管的电气设备可以与存储器元件串联耦合。 第一导电层可以由金属氮化物形成。 金属氧化物层可以包含与第一导电层相同的金属。 金属氧化物可以与第一导电层形成欧姆接触或肖特基接触。 第二导电层可以与金属氧化物层形成欧姆接触或肖特基接触。 第一导电层，金属氧化物层和第二导电层可以包括子层。 第二导电层可以包括粘合或阻挡层和功函数控制层。

    Enhanced Work Function Layer Supporting Growth of Rutile Phase Titanium Oxide
    2.
    发明申请
    Enhanced Work Function Layer Supporting Growth of Rutile Phase Titanium Oxide 有权
    增强功能层支持金红石相二氧化钛的生长

    公开(公告)号：US20130095632A1

    公开(公告)日：2013-04-18

    申请号：US13708035

    申请日：2012-12-07

    Applicant: Intermolecular, Inc.

    Inventor： Xiangxin Rui ,  Hanhong Chen ,  Pragati Kumar ,  Sandra G. Malhotra

    IPC: H01L21/02

    CPC classification number: H01L21/02 ,  B82Y99/00 ,  C01G23/047 ,  C01P2002/72 ,  C23C16/0272 ,  C23C16/34 ,  C23C16/405 ,  C23C16/45525 ,  H01L21/02186 ,  H01L21/0228 ,  H01L27/1085 ,  H01L28/40

    Abstract: This disclosure provides a method of fabricating a semiconductor stack and associated device, such as a capacitor and DRAM cell. In particular, a bottom electrode has a material selected for lattice matching characteristics. This material may be created from a relatively inexpensive metal oxide which is processed to adopt a conductive, but difficult-to-produce oxide state, with specific crystalline form; to provide one example, specific materials are disclosed that are compatible with the growth of rutile phase titanium dioxide (TiO2) for use as a dielectric, thereby leading to predictable and reproducible higher dielectric constant and lower effective oxide thickness and, thus, greater part density at lower cost.

    Abstract translation: 本公开提供了制造半导体堆叠和相关设备（诸如电容器和DRAM单元）的方法。 特别地，底部电极具有选择用于晶格匹配特性的材料。 该材料可以由相对廉价的金属氧化物制成，其被处理成具有特定结晶形式的导电但难以产生的氧化物状态; 为了提供一个实例，公开了与用作电介质的金红石相二氧化钛（TiO 2）的生长相容的具体材料，从而导致可预测和可再现的较高介电常数和较低的有效氧化物厚度，因此更大的部分密度 以较低的成本。

    Inexpensive Electrode Materials to Facilitate Rutile Phase Titanium Oxide
    3.
    发明申请
    Inexpensive Electrode Materials to Facilitate Rutile Phase Titanium Oxide 有权
    廉价的电极材料促进金红石相氧化钛

    公开(公告)号：US20130072015A1

    公开(公告)日：2013-03-21

    申请号：US13675852

    申请日：2012-11-13

    Applicant: Intermolecular, Inc.

    Inventor： Hanhong Chen ,  Toshiyuki Hirota ,  Pragati Kumar ,  Xiangxin Rui ,  Sunil Shanker

    IPC: H01L21/285

    CPC classification number: H01L28/60 ,  C23C16/405 ,  H01L27/10852 ,  H01L28/40

    Abstract: This disclosure provides a method of fabricating a semiconductor stack and associated device, such as a capacitor and DRAM cell. In particular, a bottom electrode has a material selected for lattice matching characteristics. This material may be created from a relatively inexpensive metal oxide which is processed to adopt a conductive, but difficult-to-produce oxide state, with specific crystalline form; to provide one example, specific materials are disclosed that are compatible with the growth of rutile phase titanium dioxide (TiO2) for use as a dielectric, thereby leading to predictable and reproducible higher dielectric constant and lower effective oxide thickness and, thus, greater part density at lower cost.

    Abstract translation: 本公开提供了制造半导体堆叠和相关设备（诸如电容器和DRAM单元）的方法。 特别地，底部电极具有选择用于晶格匹配特性的材料。 该材料可以由相对廉价的金属氧化物制成，其被处理成具有特定结晶形式的导电但难以产生的氧化物状态; 为了提供一个实例，公开了与用作电介质的金红石相二氧化钛（TiO 2）的生长相容的具体材料，从而导致可预测和可再现的较高介电常数和较低的有效氧化物厚度，因此更大的部分密度 以较低的成本。

    Nonvolatile Memory Elements
    4.
    发明申请
    Nonvolatile Memory Elements 有权
    非易失性存储元件

    公开(公告)号：US20130059427A1

    公开(公告)日：2013-03-07

    申请号：US13656585

    申请日：2012-10-19

    Applicant: Intermolecular, Inc.

    Inventor： Sandra G. Malhotra ,  Sean Barstow ,  Tony P. Chiang ,  Pragati Kumar ,  Prashant B. Phatak ,  Sunil Shanker ,  Wen Wu

    IPC: H01L21/02

    CPC classification number: H01L45/1608 ,  H01L27/2418 ,  H01L27/2463 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/146 ,  H01L45/1625 ,  H01L45/1641

    Abstract: Nonvolatile memory elements that are based on resistive switching memory element layers are provided. A nonvolatile memory element may have a resistive switching metal oxide layer. The resistive switching metal oxide layer may have one or more layers of oxide. A resistive switching metal oxide may be doped with a dopant that increases its melting temperature and enhances its thermal stability. Layers may be formed to enhance the thermal stability of the nonvolatile memory element. An electrode for a nonvolatile memory element may contain a conductive layer and a buffer layer.

    Abstract translation: 提供了基于电阻式开关存储元件层的非易失性存储元件。 非易失性存储元件可以具有电阻性开关金属氧化物层。 电阻式开关金属氧化物层可以具有一层或多层氧化物。 电阻式开关金属氧化物可以掺杂有增加其熔融温度并增强其热稳定性的掺杂剂。 可以形成层以增强非易失性存储元件的热稳定性。 用于非易失性存储元件的电极可以包含导电层和缓冲层。

    Methods for forming resistive switching memory elements by heating deposited layers
    5.
    发明授权
    Methods for forming resistive switching memory elements by heating deposited layers 有权
    通过加热沉积层形成电阻式开关存储元件的方法

    公开(公告)号：US09397292B2

    公开(公告)日：2016-07-19

    申请号：US14505128

    申请日：2014-10-02

    Applicant: Intermolecular Inc.

    Inventor： Pragati Kumar ,  Sean Barstow ,  Tony P. Chiang ,  Sunil Shanker

    IPC: H01L45/00 ,  H01L27/24

    CPC classification number: H01L45/1633 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/146

    Abstract: Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal annealing techniques. During heating, the oxide layer may decompose and react with the metal-containing layer. Oxygen from the decomposing oxide layer may form a metal oxide with metal from the metal-containing layer. The resulting metal oxide may exhibit resistive switching for the resistive switching memory elements.

    Abstract translation: 提供电阻式开关非易失性存储元件。 可以使用快速热退火技术来加热含金属层和用于存储元件的氧化物层。 在加热期间，氧化物层可能分解并与含金属层反应。 来自分解氧化物层的氧可以从含金属的层与金属形成金属氧化物。 所得到的金属氧化物可以表现出用于电阻式开关存储元件的电阻式开关。

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