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公开(公告)号：US20190043920A1
公开(公告)日：2019-02-07
申请号：US15670976
申请日：2017-08-07
Applicant: InvenSense, Inc.
Inventor： Renata Melamud BERGER , Julius Ming-Lin TSAI , Stephen LLOYD
Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
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公开(公告)号：US20200030850A1
公开(公告)日：2020-01-30
申请号：US16592618
申请日：2019-10-03
Applicant: InvenSense, Inc.
Inventor： Nikhil APTE , Renata Melamud BERGER , Michael DANEMAN
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US20170328866A1
公开(公告)日：2017-11-16
申请号：US15424720
申请日：2017-02-03
Applicant: InvenSense, Inc.
Inventor： Nikhil APTE , Renata Melamud BERGER , Michael DANEMAN , James Christian SALVIA
CPC classification number: G01N29/326 , B06B1/0207 , B06B1/0292 , B06B1/0622 , B06B2201/20 , B06B2201/40 , B06B2201/50 , G01N29/04 , G01N29/30 , G01N29/38 , G01N29/4463 , G01S7/5205 , G01S7/521
Abstract: An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.
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Patent Agency Ranking
公开(公告)号：US20170326594A1
公开(公告)日：2017-11-16
申请号：US15469383
申请日：2017-03-24
Applicant: InvenSense, Inc.
Inventor： Renata Melamud BERGER , Eldwin NG
IPC: B06B1/06
CPC classification number: B06B1/0662 , B06B1/06 , G10K9/122 , G10K13/00
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device includes a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies, the membrane having non-uniform stiffness. The membrane includes a piezoelectric layer, a first electrode and a second electrode coupled to opposing sides of the piezoelectric layer, and a mechanical support layer coupled to one of the first electrode and the second electrode.
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公开(公告)号：US20170326591A1
公开(公告)日：2017-11-16
申请号：US15419835
申请日：2017-01-30
Applicant: InvenSense, Inc.
Inventor： Nikhil APTE , Renata Melamud BERGER , Michael DANEMAN
CPC classification number: B06B1/064 , B06B1/0292 , B06B1/06 , B06B2201/51 , B06B2201/55
Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US20170322305A1
公开(公告)日：2017-11-09
申请号：US15266673
申请日：2016-09-15
Applicant: InvenSense, Inc.
Inventor： Nikhil APTE , Julius Ming-Lin TSAI , Michael Julian DANEMAN , Renata Melamud BERGER
IPC: G01S15/06
Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam. The activation also includes receiving reflected ultrasonic signals at a second group of ultrasonic transducers of the plurality of ultrasonic transducers.
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公开(公告)号：US20200061670A1
公开(公告)日：2020-02-27
申请号：US16107894
申请日：2018-08-21
Applicant: InvenSense, Inc.
Inventor： Mei-Lin CHAN , Nikhil APTE , Renata Melamud BERGER
Abstract: An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.
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公开(公告)号：US20170013363A1
公开(公告)日：2017-01-12
申请号：US14962182
申请日：2015-12-08
Applicant: INVENSENSE, INC.
Inventor： Renata Melamud BERGER , Sushil BHARATAN , Thomas CHEN
CPC classification number: H04R7/20 , B81B3/00 , H04R1/04 , H04R7/24 , H04R19/005 , H04R19/04 , H04R31/006
Abstract: A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.
Abstract translation: 微机电麦克风具有可以减轻或避免微机电麦克风中的机械不稳定性的静止区域或另一类型的机械支撑区域。 通过刚性电介质构件将隔膜的内部部分刚性地附接到微机电麦克风的背板上，可以在微机电麦克风的隔膜中形成固定区域。 刚性电介质构件可以在背板和隔膜之间延伸。 在某些实施例中，电介质构件可以是中空的，形成中心对称的或具有另一种类型对称的壳。 在其他实施例中，电介质构件可以限定芯 - 壳结构，其中第一介电材料的外壳限定填充有第二电介质材料的内开口。 多个电介质构件可以将隔膜刚性地附接到背板。 扩展电介质构件可以将非平面隔膜刚性地附接到背板。
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