公开(公告)号：EP2209865B1

公开(公告)日：2013-05-01

申请号：EP08849069.3

申请日：2008-11-12

Applicant: Invista Technologies S.à.r.l.

Inventor： COVELLI, Carmen, A. ,  FARMER, Douglas, K. ,  MASTERS, Gavin, N.

IPC: C09J7/04 ,  C09J5/06 ,  C09J175/02

CPC classification number: B32B37/0038 ,  B29C65/4815 ,  B29C65/482 ,  B29C65/50 ,  B29C65/8207 ,  B29C65/8223 ,  B29C66/727 ,  B29C66/91221 ,  B29C66/91411 ,  B29C66/91443 ,  B29C66/9192 ,  B29C66/91951 ,  B29K2001/00 ,  B29K2007/00 ,  B29K2021/00 ,  B29K2023/00 ,  B29K2067/00 ,  B29K2067/043 ,  B29K2075/00 ,  B29K2075/02 ,  B29K2077/00 ,  B29K2105/04 ,  B29K2311/10 ,  B29K2313/00 ,  B29L2031/4871 ,  B29L2031/4885 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B9/025 ,  B32B27/065 ,  B32B27/12 ,  B32B27/18 ,  B32B27/22 ,  B32B27/32 ,  B32B27/34 ,  B32B37/06 ,  B32B2250/40 ,  B32B2262/0246 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/08 ,  B32B2262/14 ,  B32B2270/00 ,  B32B2305/18 ,  B32B2307/402 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2309/02 ,  B32B2309/08 ,  B32B2309/12 ,  B32B2323/00 ,  B32B2375/00 ,  B32B2377/00 ,  B32B2433/02 ,  B32B2437/00 ,  B32B2471/02 ,  B32B2535/00 ,  B32B2555/00 ,  B32B2601/00 ,  C09J5/06 ,  C09J7/21 ,  C09J7/35 ,  C09J175/02 ,  C09J2400/263 ,  C09J2475/00 ,  Y10T442/273

Abstract: Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.