公开(公告)号：US09435032B2

公开(公告)日：2016-09-06

申请号：US14253459

申请日：2014-04-15

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Tatsuya Shimoda ,  Yasuo Matsuki ,  Zhongrong Shen

IPC: C23C18/16 ,  C23C18/10 ,  H05K3/18 ,  C23C18/06 ,  C23C18/08 ,  C23C18/42 ,  C23C22/73

CPC classification number: C23C18/1603 ,  C23C18/06 ,  C23C18/08 ,  C23C18/10 ,  C23C18/42 ,  C23C22/73 ,  H05K3/182 ,  H05K2203/0709 ,  H05K2203/1105 ,  Y10T428/12028 ,  Y10T428/12493 ,  Y10T428/1275 ,  Y10T428/24917

Abstract: The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Abstract translation: 根据本发明，提供了形成图案化导电层的方法，其可以确保与基板的电粘合，并且也可以简单地适用于各种电子器件，而不需要大型和重型的装置。