公开(公告)号：US20090190309A1

公开(公告)日：2009-07-30

申请号：US12137781

申请日：2008-06-12

Applicant: LIANG-QING SHAN ,  YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LIANG-LIANG CAO ,  LEI GUO

Inventor： LIANG-QING SHAN ,  YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LIANG-LIANG CAO ,  LEI GUO

IPC: H05K7/20

CPC classification number: H05K7/20563 ,  H05K7/186

Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

Abstract translation: 电子设备包括外壳（30），电路板（40），风扇模块（20）和安装在外壳中的空气引导元件（10）。 电路板包括至少一个发热部件（41）。 风扇模块具有与风扇对应的风扇（22）和输出开口（213）。 空气引导元件包括阻挡板（11），并且引导板（12）包括朝向风扇模块的输出开口延伸的自由端。 所述至少一个发热部件和所述输出开口位于所述抵抗板的同一侧。 引导板限定了连接抵抗板的自由端（127）和连接端（125）。 由引导板的端部限定的平面相对于电阻板以大于90度的角度排列。

公开(公告)号：US20090166164A1

公开(公告)日：2009-07-02

申请号：US12102019

申请日：2008-04-14

Applicant: ZHI-PING WU ,  CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

Inventor： ZHI-PING WU ,  CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

IPC: H01H3/20

CPC classification number: H01H3/46 ,  G06F1/181

Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.

Abstract translation: 用于按压计算机挡板中的开关的按钮组件包括连接到臂的按钮。 计算机挡板中定义了一个切口。 按钮插入切口，臂可枢转地安装在计算机挡板上。 按压部从臂的一侧向外延伸。 在按压部上形成有倾斜的按压面。 按下按钮可移动手臂，使倾斜按压平面远离手臂的一端接触开关。 开关抵抗按压部，使臂旋转，使得倾斜按压面的另一端向前移动，由此倾斜的按压面完全接触并启动开关。

公开(公告)号：US20100128442A1

公开(公告)日：2010-05-27

申请号：US12464519

申请日：2009-05-12

Applicant: ZHI-PING WU ,  XIAO-FENG WANG ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： ZHI-PING WU ,  XIAO-FENG WANG ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base.

Abstract translation: 散热器组件包括印刷电路板，安装在用于接收芯片的板的顶表面上的插座和附接到板的芯片上的散热器。 插座包括从插座的底表面向下整体延伸的多个脚。 腿接触板的顶面以支撑板上的插座。 散热器包括基座，从基座向上延伸的多个翅片以及从基座向下延伸的多个腿部。

公开(公告)号：US20100096170A1

公开(公告)日：2010-04-22

申请号：US12645303

申请日：2009-12-22

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces arranged thereon. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided.

Abstract translation: 电路板包括信号平面和接地平面。 信号平面被配置为具有布置在其上的多个信号迹线。 每个信号迹线包括多个直线段。 每个线段沿着与其他线不同的路径延伸。 接地平面包括以阵列连接的多个瓦。 每个瓷砖由地面痕迹形成。 映射在接地平面上的每个信号迹线的直线段相对于瓦片的任何一个接地迹线以一定角度布置。 该角度限定在由瓦片的接地轨迹和瓦片的相邻对角线之一确定的范围内。 还提供了布线这种电路板的方法。

公开(公告)号：US20090171604A1

公开(公告)日：2009-07-02

申请号：US12124782

申请日：2008-05-21

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: G01R27/06 ,  G01R27/32

CPC classification number: G01R27/32 ,  G01R35/00

Abstract: The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S′], wherein matrix S′ is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S′], and choosing an eigenvalue Ψ whose real part real(Ψ) is the biggest; (4) computing a compensating value ξ, the compensating value ξ being equal to real(Ψ)1/2×(1+ε), wherein the ε is a very small positive number; and (5) dividing each of the S-parameters by the compensating value ξ to get the compensated S-parameters.

Abstract translation: 本发明涉及一种用于补偿不满足被动无源电路的S参数的方法和电路。 该方法包括以下步骤：（1）获得不满足被动的S参数，这些S参数由S参数矩阵S组成; （2）计算矩阵[SxS']，其中矩阵S'是S参数矩阵S的复共轭转置矩阵; （3）计算矩阵[SxS']的特征值，并选择其实部实数（Psi）最大的特征值Psi; （4）计算补偿值xi，补偿值xi等于实数（Psi）1 / 2x（1 +ε），其中ε是非常小的正数; 和（5）将每个S参数除以补偿值xi以获得经补偿的S参数。

公开(公告)号：US20090168361A1

公开(公告)日：2009-07-02

申请号：US12180221

申请日：2008-07-25

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base.

Abstract translation: 印刷电路板组件包括其上附着有发热元件的印刷电路板，基座和热敏板。 发热部件包括侧面。 基座定义了接收室和被配置为进入接收室的开口。 印刷电路板通过开口接收在接收室中。 热板安装在基座上以覆盖开口。 导热片形成在热板上并延伸到接收室。 导电件包括从热板延伸并与侧表面接触的接触部分。 导电件构造成用于将热量从发热部件传导到热板。 在热板上限定散热孔，该散热孔与构造成从底部散热的接触部分对齐。

公开(公告)号：US20090166062A1

公开(公告)日：2009-07-02

申请号：US12118684

申请日：2008-05-10

Applicant: ZHI-PING WU ,  JENG-DA WU ,  YU-HSU LIN ,  CHIH-HANG CHAO ,  LIANG-LIANG CAO

Inventor： ZHI-PING WU ,  JENG-DA WU ,  YU-HSU LIN ,  CHIH-HANG CHAO ,  LIANG-LIANG CAO

IPC: H05K1/00

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.

Abstract translation: 印刷电路板组件包括印刷电路板，载体，安装在载体上的半导体芯片，焊接在印刷电路板和用于传输信号的载体之间的多个锡球，以及胶合到半导体芯片的散热片 散热 在散热器的底部形成有按压部，不与半导体芯片接触。 按压部分与载体的周边接触以加强位于印刷电路板和载体之间的锡球。

公开(公告)号：US20110188219A1

公开(公告)日：2011-08-04

申请号：US12753299

申请日：2010-04-02

Applicant: JENG-DA WU

Inventor： JENG-DA WU

IPC: H05K1/18

CPC classification number: H05K1/18

Abstract: A circuit board assembly includes a circuit board having a first side and a second side opposite to the first side. A chip module is connected to the first side of the circuit board. The chip module includes a substrate and a chip disposed on the substrate. The first clamping member defines a recess and a contact portion around the recess. The chip is received in the recess, and the contact portion abuts the substrate. A second clamping member abuts the second side of the circuit board. A plurality of stress adjusting members extends through the second clamping member and engages the first clamping member.

Abstract translation: 电路板组件包括具有第一侧和与第一侧相对的第二侧的电路板。 芯片模块连接到电路板的第一侧。 芯片模块包括衬底和设置在衬底上的芯片。 第一夹紧构件限定凹部和围绕凹部的接触部分。 芯片被容纳在凹部中，并且接触部分邻接衬底。 第二夹紧构件邻接电路板的第二侧。 多个应力调节构件延伸穿过第二夹紧构件并接合第一夹紧构件。

公开(公告)号：US20110188208A1

公开(公告)日：2011-08-04

申请号：US12830483

申请日：2010-07-06

Applicant: JENG-DA WU

Inventor： JENG-DA WU

IPC: H05K7/20

CPC classification number: H05K7/20

Abstract: A heat dissipating system includes a circuit board, a chip module, a first clamping member, a second clamping member, and a plurality of stress adjusting members. The circuit board includes a top surface and a bottom surface opposite to the top surface. The chip module includes a base portion located on the top surface of the circuit board via solder balls and a chip disposed on the base portion. The first clamping member abuts the chip. The second clamping member abuts the bottom surface of the circuit board. The stress adjusting members extend through the second clamping member and engage with the first clamping member.

Abstract translation: 散热系统包括电路板，芯片模块，第一夹紧构件，第二夹紧构件和多个应力调节构件。 电路板包括顶表面和与顶表面相对的底表面。 芯片模块包括通过焊球位于电路板的顶表面上的基部和设置在基部上的芯片。 第一夹紧构件邻接芯片。 第二夹紧构件邻接电路板的底面。 应力调节构件延伸穿过第二夹紧构件并与第一夹紧构件接合。

公开(公告)号：US20090016024A1

公开(公告)日：2009-01-15

申请号：US11849306

申请日：2007-09-03

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

IPC: H05K7/20 ,  H05K7/02

CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10734

Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括平行布置在印刷电路板上的印刷电路板，第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击，则可以有效地最小化或防止对芯片的损坏。