公开(公告)号：US20240409704A1

公开(公告)日：2024-12-12

申请号：US18700608

申请日：2022-10-07

Applicant: JSP Corporation

Inventor： Yukiya SAITO ,  Hajime OHTA

IPC: C08J9/18 ,  C08J9/00 ,  C08J9/12

Abstract: A polypropylene-based resin expanded bead, in which the melting point Tma of a polypropylene-based resin (a) constituting a core layer in an expanded state is 135° C. or higher and 155° C. or lower; a polypropylene-based resin (b) constituting a covering layer contains a propylene-based copolymer containing a propylene component, an ethylene component, and a butene component, as a main component; the difference [Tma−Tmb] between the melting point Tma of the polypropylene-based resin (a) and the melting point Tmb of the polypropylene-based resin (b) is 1° C. or more and 30° C. or less; the difference [Tmb−Tcb] between the melting point Tmb of the polypropylene-based resin (b) and the crystallization temperature Tcb of the polypropylene-based resin (b) is 40° C. or less; and the covering layer contains a higher fatty acid amide.