公开(公告)号：US10392699B2

公开(公告)日：2019-08-27

申请号：US15509662

申请日：2015-09-08

Applicant: JSR CORPORATION

Inventor： Hitoshi Hamaguchi ,  Kenrou Tanaka ,  Kenzou Ookita ,  Keisuke Kuriyama

IPC: C23C16/44 ,  H05K3/00 ,  G03F7/20 ,  B05D3/06 ,  B29C59/16 ,  C08J7/00 ,  G03F7/039 ,  C09D129/10 ,  C09D133/10 ,  C09D133/14 ,  C09D133/16 ,  C23C16/56 ,  H05K3/12 ,  G03F7/004 ,  G03F7/18 ,  G03F7/24

Abstract: The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i): (i) the step of forming a coating film on a non-flat surface of a structure using a resin composition which includes an acid-dissociable group-containing polymer and an acid generator; and (ii) the step of forming a recess by subjecting a prescribed part of a portion of the coating film to irradiation with radiation.

公开(公告)号：US10032920B2

公开(公告)日：2018-07-24

申请号：US15582823

申请日：2017-05-01

Applicant: JSR Corporation

Inventor： Hitoshi Hamaguchi ,  Kenrou Tanaka ,  Kenzou Ookita ,  Keisuke Kuriyama

IPC: H01L27/12 ,  H01L29/786 ,  H01L29/66 ,  H01L21/288

CPC classification number: H01L29/78636 ,  H01L21/28 ,  H01L21/288 ,  H01L29/66742 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/66969 ,  H01L29/78 ,  H01L29/7869

Abstract: The thin film transistor includes a first insulating layer provided on a substrate; a source electrode and a drain electrode that are provided on the first insulating layer; a semiconductor layer provided so as to cover the first insulating layer, the source electrode, and the drain electrode; a second insulating layer provided on the semiconductor layer; and a gate electrode provided on the second insulating layer, in which the first insulating layer is formed of a hydrophilic/hydrophobic material and has a recess portion, and the source electrode and the drain electrode are provided so as to fill the recess portion of the first insulating layer.

公开(公告)号：US09980392B2

公开(公告)日：2018-05-22

申请号：US15262404

申请日：2016-09-12

Applicant: JSR CORPORATION

Inventor： Hitoshi Hamaguchi ,  Kenrou Tanaka ,  Kenzou Ookita ,  Keisuke Kuriyama

IPC: G03F7/039 ,  G03F7/36 ,  G03F7/40 ,  H03K3/10 ,  H05K3/12 ,  H05K3/10 ,  G03F7/004 ,  G03F7/027 ,  G03F7/20

CPC classification number: H05K3/107 ,  G03F7/0046 ,  G03F7/027 ,  G03F7/0392 ,  G03F7/36 ,  G03F7/40 ,  G03F7/70 ,  H05K3/105 ,  H05K3/1258

Abstract: A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.

公开(公告)号：US09746775B2

公开(公告)日：2017-08-29

申请号：US14888244

申请日：2014-04-15

Applicant: JSR CORPORATION

Inventor： Hitoshi Hamaguchi ,  Kenrou Tanaka ,  Kenzou Ookita ,  Keisuke Kuriyama

IPC: G03F7/039 ,  G03F7/038 ,  G03F7/36 ,  H05K1/02 ,  H05K3/12 ,  G03F7/38 ,  H05K3/10 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  H05K3/28

CPC classification number: G03F7/38 ,  G03F7/0046 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/16 ,  G03F7/20 ,  G03F7/36 ,  H05K1/0296 ,  H05K3/107 ,  H05K3/1208 ,  H05K3/287 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0166

Abstract: Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device.The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.