公开(公告)号：WO2006077167A3

公开(公告)日：2006-11-09

申请号：PCT/EP2006000616

申请日：2006-01-24

Applicant: JUMA PCB GMBH ,  WOELFEL MARKUS

Inventor： WOELFEL MARKUS

IPC: H05K3/20

CPC classification number: H05K3/103 ,  H05K13/06 ,  H05K2201/10287 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: The invention relates to a method for welding a conductor to a conductive film, which is preferably connected to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.

Abstract translation: 本发明涉及焊接导线到其优选用于连接到用于制造印刷电路板，所述导电线的厚度或直径的印刷电路板的载体的导电膜的方法是优选比导电箔的厚度大。 导电箔是在这种情况下 - 在焊接过程中至少 - 具有热分离板是在接触时，热导率比导电膜的低。

公开(公告)号：WO2006077163A3

公开(公告)日：2007-02-15

申请号：PCT/EP2006000612

申请日：2006-01-24

Applicant: JUMA PCB GMBH ,  WOELFEL MARKUS

Inventor： WOELFEL MARKUS

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.

Abstract translation: 本发明涉及的线描述的印刷电路板或板（1）上和/或在连接点之间的印刷电路板或卡（4）延伸的线（6）。 为了改善这样的电路板，它提供了引线（6）中的至少一个具有矩形或正方形横截面。 还可以设想的是，至少一些引线的中空横截面，其中autweisen的循环的冷却剂或加热装置。

公开(公告)号：WO2006077164A2

公开(公告)日：2006-07-27

申请号：PCT/EP2006000613

申请日：2006-01-24

Applicant: JUMA PCB GMBH ,  WOELFEL MARKUS

Inventor： WOELFEL MARKUS

IPC: H05K1/11

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K3/103 ,  H05K3/36 ,  H05K2201/10287 ,  H05K2203/0228

Abstract: The invention relates to a method for producing an angled printed circuit board structure from at least two circuit board sections, said method comprising the following steps: a) production of a level printed circuit board (1) comprising at least one conductor (4), which is embedded to a great extent in the printed circuit board (1), extends between two regions of the printed circuit board (1) that are configured as connection points (6) and is connected to the latter in an electrically conductive manner, the two regions that are configured as connection points (6) being located on different printed circuit board sections (12, 14, 16, 18, 20, 22); b) provision of at least one region that is designed to be angled, preferably an edge (28) between the printed circuit board sections (12, 14, 16, 18, 20, 22). Said circuit board sections (12, 14, 16, 18, 20, 22) can be angled in relation to one another, whilst retaining the conductor connection between the regions that are configured as connection points (6) by bending said conductor(s) (4).

Abstract translation: 本发明涉及一种方法，用于制造至少两个电路板部分的可弯曲的印刷电路板结构，其包括以下步骤：a）制备的平面印刷电路板（1）具有至少一个至少主要（在嵌入在印刷电路板1）引线4是两个之间 （6）提供的延伸的连接点用于将电路板（1）的区域，并连接到该导电性的，其中所述两个作为连接点（6）设置在不同的电路板部分的区域（12，14，16，18，20，22）位于; b）提供至少一个规定的弯曲部，优选Abwinkelkante（28）的印刷电路板的部分（12，14，16之间，18，20，22），所述印刷电路板的部分（12，14，16，18，20，22） 是相互成角度的，同时保持连接点的连接（6）由所述至少一根引线（4）提供，并弯曲所述至少一个引线的区域（4）。

公开(公告)号：DE102005003369A1

公开(公告)日：2006-07-27

申请号：DE102005003369

申请日：2005-01-24

Applicant: JUMA PCB GMBH

Inventor： WOELFEL MARKUS

IPC: H05K3/10 ,  H05K3/40

公开(公告)号：DE102005003370A1

公开(公告)日：2006-07-27

申请号：DE102005003370

申请日：2005-01-24

Applicant: JUMA PCB GMBH

Inventor： WOELFEL MARKUS

IPC: H05K13/06

Abstract: A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.