Abstract:
An improved process for making a vertical MOSFET structure comprising: A method of forming a semiconductor memory cell array structure comprising: providing a vertical MOSFET DRAM cell structure having a deposited gate conductor layer planarized to a top surface of a trench top oxide on the overlying silicon substrate; forming a recess in the gate conductor layer below the top surface of the silicon substrate; implanting N-type dopant species through the recess at an angle to form doping pockets in the array P-well; depositing an oxide layer into the recess and etching said oxide layer to form spacers on sidewalls of the recess; depositing a gate conductor material into said recess and planarizing said gate conductor to said top surface of the trench top oxide.
Abstract:
A current sense amplifier circuit for a semiconductor memory device includes a differential amplifier which senses the signal currents input to first and second input nodes, amplifies the difference between the two signals and outputs the sense-amplified signals to first and second output nodes. A first feedback circuit is connected between the second input node and a current controlling node and has a controlling terminal connected to the first output node. A second feedback circuit is connected between the first input node and the current controlling node and has a controlling terminal connected to the second output node. By feeding back voltages from the counterpart output nodes through the cross-connected feedback circuits, the difference between low level input signals can be efficiently detected and a stable sense-amplified output is obtained.
Abstract:
The present invention relates to a nonvolatile memory device and a manufacturing method thereof, the device comprising a plurality of word lines; a plurality of bit lines perpendicular to the word lines; and a plurality of memory cells including a transistor with a source connected to a source line, a gate, and a drain connected to a memory element, with the other end of the memory element connected to the bit lines. Between memory cells adjacent along a bit line, a gate terminal in a groove between the memory cells connects the gates in the memory cells to a word line. Memory cells adjacent along a word line are connected to one bit line contact point, and memory cells sharing a gate terminal are connected to different bit lines. Bit lines are disposed at the upper portion and source lines at the lower end of the memory cell.
Abstract:
A dynamic random access memory (DRAM) cell and the method of manufacturing the same are provided. The DRAM cell includes a cell transistor and a cell capacitor. The cell capacitor includes a first, second and third dielectric layer, and a first, second and third capacitor electrode. The first dielectric layer is located on a first capacitor electrode. The second capacitor electrode is located on top of the first dielectric layer. The second dielectric layer is located on the second capacitor electrode. The third capacitor electrode is located on the second dielectric layer and is electrically connected with the drain. The third dielectric layer is located between the third capacitor electrode and the gate for isolating the gate from the third capacitor electrode.
Abstract:
The present invention relates to a memory device having 4F2 size cells and a method for fabricating the same. The memory device comprises plural word lines arranged parallel to each other in one direction, plural bit lines arranged parallel to each other, and plural memory cells having a transistor that fills a groove between two adjoining memory cells in a direction of the bit lines. A side wall between the two adjoining memory cells is simultaneously covered by an insulating film formed between the gate terminal and the two memory cells. The gate terminal is connected electrically to a word line, drain terminals of two adjoining memory cells are connected electrically to a bit line, and the gate and drain terminals are alternately arranged. One of the plural memory cells is buried in the substrate, and is electrically connected with a substrate or a well formed in the substrate.
Abstract:
A method for fabricating a semiconductor device with different gate oxide layers. Oxidation is controlled in accordance with the active area dimension so that oxide grows thin at a wider active width (peripheral region) and grows thickly at a narrower active width (cell array region). A gate pattern is formed on a semiconductor substrate having different active areas. Gate spacers are formed and then active dimension dependent oxidation process is performed to grow the oxide layers differently from one another.
Abstract:
Driving circuits with active body pull-capability for inhibiting boost delay include main, subordinate and boosted signal lines and a first driver circuit electrically coupled to the main signal line, to drive the main signal line at a first potential (e.g., Vcc). A second driver circuit, electrically coupled to the boosted signal line, is also provided to drive the boosted signal line at a second potential (e.g., Vpp) greater than the first potential. A first field effect transistor is provided as a pull-up transistor which has a gate, drain and source electrically coupled to the main signal line, the boosted signal line and the subordinate signal line, respectively. To reduce body-bias effects which might inhibit the speed and pull-up capability of the pull-up transistor, a second field effect transistor is provided to actively pull-up the body (e.g., active region) of the pull-up transistor. This second field effect has a gate, drain and source electrically coupled to the main signal line (or boosted signal line), the boosted signal line and the body of the pull-up transistor, respectively. The second field effect transistor is designed to provide a pull-up function to the body of the pull-up transistor so that the magnitude of the reverse bias between an inversion layer channel (e.g., N-type) and the body region (e.g., P-type) of the pull-up transistor is reduced when the pull-up transistor is turned on to provide a voltage boost to the subordinate signal line. This reduction in the reverse bias results in a reduction of the body-bias effect and the increase in threshold voltage typically associated with the body-bias effect.
Abstract:
A dynamic random access memory (DRAM) cell and the method of manufacturing the same are provided. The DRAM cell includes a cell transistor and a cell capacitor. The cell capacitor includes a first, second and third dielectric layer, and a first, second and third capacitor electrode. The first dielectric layer is located on a first capacitor electrode. The second capacitor electrode is located on top of the first dielectric layer. The second dielectric layer is located on the second capacitor electrode. The third capacitor electrode is located on the second dielectric layer and is electrically connected with the drain. The third dielectric layer is located between the third capacitor electrode and the gate for isolating the gate from the third capacitor electrode.
Abstract:
A reference voltage generator includes a pull-up stage which pulls a reference voltage signal rapidly up toward 1/2Vcc at power-up. The pull-up stage is controlled by a controller which has a comparator and control voltage generator which are disabled after the pull-up operation is terminated so as to reduce stand-by current consumption. The controller includes a pair of NAND gates cross connected as an RS flip-flop to turn on the pull-up stage at power up. A boost signal allows the flip-flop to enable the comparator and control voltage generator after the power supply has stabilized. When the reference voltage signal reaches 1/2Vcc, the comparator sets the flip flop which turns off the pull-up stage and disables the comparator and control voltage generator.
Abstract translation:一个参考电压发生器包括一个上拉电平,它在上电时将参考电压信号快速上升至+ E,加1/2 + EE Vcc。 上拉级由控制器控制,控制器具有比较器和控制电压发生器,在上拉操作结束后禁止,以减少待机电流消耗。 控制器包括一对NAND门,它们作为RS触发器交叉连接,以在上电时接通上拉电平。 升压信号允许触发器在电源稳定后使能比较器和控制电压发生器。 当参考电压信号达到+ E,fra 1/2 + EE Vcc时,比较器设置关闭上拉电平的触发器,并禁止比较器和控制电压发生器。
Abstract:
A voltage driving circuit for use in a semiconductor memory device. The voltage driving circuit includes a generator which generates a first voltage for an operating mode of the device, a generator which generates a second voltage for a standby mode, and a pair of switches connected between the voltage generators and an operating circuit, for selectively supplying the first and second voltages thereto. The first and second switches each have a control terminal, both of which are commonly coupled to a mode signal, for allowing external control of the voltage selection. The first and second voltages are preferably set relative to each other so as to reduce the subthreshold leakage current consumed by the semiconductor memory during a standby mode, while maintaining a desired operating speed during an operating mode.