Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition allowing formation of a resist pattern excellent in LWR performance and MEEF performance.SOLUTION: A photoresist composition contains [A] a polymer having a structural unit (I) represented by Formula (1) and [B] an acid generator. The [A] polymer preferably has further a structural unit (II) represented by Formula (2). In Formula (2), R, Rand Ris an alkyl group having a carbon number of 1 to 4 or a monovalent alicyclic group having a carbon number of 4 to 20.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition useful as a chemically amplified resist satisfying excellent resolution, small LWR (Line Width Roughness), excellent pattern collapse resistance and excellent in non-defectiveness, and to provide a polymer usable as a resin component in the radiation-sensitive resin composition. SOLUTION: The radiation-sensitive resin composition includes a resin (A) and a radiation-sensitive acid generator (B). The resin (A) is a polymer including a specific repeating unit (a-1) derived from a (meth)acrylic ester substituted by an oxyalkylene group having norbornane lactone at a terminal, a specific repeating unit (a-2) derived from a (meth)acrylic ester having a sulfonamide group, and a repeating unit (a-3) having an acid dissociable group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin and a radiation-sensitive resin composition satisfying excellent resolution, small LWR (Line Width Roughness), good PEB (Post Exposure Bake) temperature dependency, excellent pattern collapse resistance and low defectiveness, that is, excellent in non-defectiveness. SOLUTION: The resin is a copolymer resin (A) of a (meth)acrylic ester of an alcohol having a heterocycle in which a norbornane ring and a lactone ring are condensed and a (meth)acrylic ester of an alcohol having a cyclopentane ring. The radiation-sensitive resin composition includes the resin and a radiation-sensitive acid generator (B). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method which can form a pattern on a second layer by exposing while maintaining the pattern formed on a first layer by inactivating it for preventing it from becoming alkali soluble due to photosensing at the second exposing in a double exposing pattern formation. SOLUTION: This pattern forming method has a step of forming a first resist layer on the substrate by using a resin composition for the first resist layer and forming a first resist pattern by radiating a radioactive ray on its required area of the first resist layer to expose and develop, a step of inactivating the first resist pattern to light, a step of forming a second resist layer on the substrate which has the first resist pattern by using a resin composition for the second resist layer and radiating a radioactive ray on its required area to expose, and a step of forming a second resist pattern by developing in the space of the first resist pattern. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is a material of a resist film that obtains a good pattern shape, has excellent depth of focus, prevents elution into a liquid for liquid immersion exposure, such as water, ensures a large receding contact angle to the liquid for liquid immersion exposure, and prevents development defects, and to provide a polymer to be used as a resin component of the radiation-sensitive resin composition, and a resist pattern forming method using the radiation-sensitive resin composition.SOLUTION: In the invention, a plurality of fluorine atom-containing polymers are used at the same time. The radiation-sensitive resin composition comprises a fluorine atom-containing polymer (A1) which, under the following conditions, dissolves in a 2.38% aqueous solution of tetramethylammonium hydroxide at 23°C at a dissolution rate of
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is a material for resists having excellent resolution, etc. SOLUTION: The radiation-sensitive resin composition comprises (A) a compound represented by general formula (1): X + Z - (X + is a cation represented by general formula (1-1) or (1-2), and Z - is an anion such as OH - ), (B) a resin comprising repeating units represented by general formula (2) and repeating units represented by general formula (3), and (C) a radiation-sensitive acid generator. In the general formulae (1-1), (1-2), (2) and (3), R 2 -R 7 are H or the like; R 8 is an alicyclic hydrocarbon group or the like; A is a single bond or the like; and R 9 is a monovalent organic group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has a large depth of focus and ensures small LWR and MEEF, excellent pattern collapse resistance and excellent development defect control property. SOLUTION: The radiation-sensitive resin composition includes: a polymer (A) having one or more repeating units represented by general formulae (1) and (2) and one or more repeating units (3) having a carbonate structure; and a radiation-sensitive acid generator (B). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition which has excellent resolution performance, a low LWR (Line Width Roughness), excellent pattern collapse resistance and excellent defectiveness. SOLUTION: In the radiation-sensitive resin composition including a resin (A) and a radiation-sensitive acid generator (B), the resin (A) is a polymer including a (meth)acrylate unit (a-1) having, at its side chain, a norbornyl lactone group bonded to a 1-12C alkylene group or alicyclic alkylene group, a (meth)acrylate unit (a-2) having, at its side chain, a methylene group having a hydrogen atom, a hydroxyl group, or an acyl group at its terminal and a repeating unit (a-3) having an acid-dissociable group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is adaptable to the formation of a fine resist pattern using a light source of a short wavelength up to 90 nm, excels in resolution, ensures small LWR and good PEB temperature dependency, excels in pattern collapse resistance and hardness to cause defect, and is suitably used even in an immersion exposure step. SOLUTION: The radiation-sensitive resin composition includes a resin (A) including a repeating unit (a-1) having adamantyl lactone in a side chain and a repeating unit (a-2) having an acid dissociable group and a radiation-sensitive acid generator (B) including a sulfonium salt of a specific structure. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is excellent in resolution performance, small in LWR (Line Width Roughness), favorable in PEB (Post Exposure Bake) temperature dependency and useful as a chemically amplified resist. SOLUTION: The radiation-sensitive resin composition includes a resin (A) and a radiation-sensitive acid generator (B), wherein the resin (A) is a mixed polymer including 0.1-20 pts.mass of a second resin (A2) based on 100 pts.mass of a first resin (A1), wherein the first resin (A1) is a polymer which is made alkali-soluble by the action of an acid and contains no fluorine atom, and the second resin (A2) includes a repeating unit (a2-1) having a norbornane lactone ether group in a side chain and a repeating unit (a2-2) containing a fluorine atom. COPYRIGHT: (C)2010,JPO&INPIT