Abstract:
PROBLEM TO BE SOLVED: To provide a composition having high transparency for radiation at short wavelengths, excellent solubility with a developer and excellent sensitivity, pattern profile and etching resistance. SOLUTION: The radiation-sensitive resin composition contains a resin having a functional group which increases solubility with an alkali by the effect of an acid, and a radiation-sensitive acid generating agent. The resin has a repeating unit expressed by formula (1). In formula (1), R independently represents a hydrogen atom, a 1-4C alkyl group or a 1-4C perfluoroalkyl group, R 1 represents a hydrocarbon group or an oxygen-containing hydrocarbon group, n is 0 or 1 and m is 1 or 2. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a new acid-dissociating group-containing resin and a radiation-sensitive resin composition having high transparency to a radiation, satisfying basic performances required by a resist, such as sensitivity, resolution, dry etching resistance and pattern shape, excellent in adhesiveness to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The acid-dissociating group-containing resin is alkali-insoluble or slightly alkali-soluble, becomes readily alkali-soluble by the action of an acid and contains a repeating unit containing an ether bond in the principal chain. The radiation-sensitive resin composition comprises the acid-dissociating group-containing resin and a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition useful as a chemically amplified resist having high transmittance of radiation and excelling in sensitivity, resolution, dry etching resistance and pattern profile. SOLUTION: The radiation-sensitive resin composition comprises (A) resin having at least two recurring units selected out of recurring units derived from (meta) acrylic ester having a specific alicyclic hydrocarbon group, in the total amount of 5-70 mol% but each in the amount of 1-49 mol%, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a (meth)acrylic polymer high in transparency to radiation, excellent in basic properties as a resist such as sensitivity, resolution, dry etching resistance, pattern form, etc. especially excellent in the solubility to a resist solvent, and suitable for a radiation-sensitive resin compound which reduces the roughness on a pattern sidewall after developing. SOLUTION: This (meth)acrylic polymer contains a repeating unit represented by formula (1) wherein R represents hydrogen or a methyl group, X represents a single bond or a 1-3C divalent organic group, Y represents a mutually independent single bond or a 1-3C divalent organic group, and R 1 represents a mutually independent hydrogen atom, a hydroxy group, a cyano group, or a -COOR 3 group. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a novel radiation sensitive resin composition having high transparency to radiation, excellent basic physical properties for a resist pattern such as in sensitivity, resolution, and pattern shapes, without causing development defects during fine machining, to manufacture semiconductor elements at a high yield. SOLUTION: The radiation-sensitive resin compositions comprises (A) a resin containing an acid dissociable group obtained by the open ring polymerization of the norbornene derivative having a structure shown by the following general formula (1), and (B) a radiation-sensitive acid generator. In the general formula (1), R 1 represents a hydrogen atom and a univalent acid dissociation group, X 1 a low-grade fluorinated alkyl group, and R 2 a hydrogen atom, an alkyl group or a fluorinated alkyl group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to radiation, excellent in sensitivity, resolution, dry etching resistance, pattern profile, etc., and useful as a chemically amplified resist. SOLUTION: The radiation-sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble resin which has at least two repeating units selected from the group of the repeating units represented by formulae (1)-(6) in an amount of 1-49 mol% each and in a total amount of 5-50 mol% and is made readily alkali-soluble by the action of an acid and (B) a radiation-sensitive acid generator. In formulae (1)-(6), R 1 denotes H or methyl; R 2 denotes alkyl which may have a 1-4C substituent. and when a plurality of symbols R 2 are present, they may be the same or different. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and suitable for use as a chemically amplified resist excellent in basic properties as a resist, such as sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin which becomes alkali-soluble by the action of an acid and contains a repeating unit derived from (meth)acrylic esters typified by 1-(2-norbornyl)-1-methylethyl (meth)acrylate and 2-ethyl-2-adamantyl (meth)acrylate and a repeating unit derived from (meth)acrylic esters having a lactone skeleton typified by a compound represented by formula (i) or (ii) (where R is H or methyl) and (B) a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a refining method of a polymer for removing a low solubility component that causes development defects, and to provide a polymer solution obtained by the refining method. SOLUTION: The refining method includes: a first step of dissolving a polymer insoluble in an alkali or hardly soluble with in alkali and converted into alkali-soluble by an action of an acid, into a good solvent that dissolves the polymer to obtain a polymer solution; a second step of adding a poor solvent that does not dissolve the polymer but is compatible with the good solvent, to the polymer solution in a range not to induce sedimentation by the polymer; and a third step of filtering the polymer solution after the second step. The poor solvent is added in an amount not more than 100 parts by mass with respect to 100 parts by mass of the good solvent, and the filter used for filtration has a pore diameter of not more than 1.0 μm. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an acrylic polymer which is suitable for a radiation-sensitive resin composition which has high transparency to radiation and excels in the basic properties (e.g. sensitivity, resolution, dry etching resistance, and pattern shape) as a resist and particularly excels in contact hole formation. SOLUTION: The acrylic polymer contains repeating units represented by formula (5-1), repeating units represented by (5-2), and repeating units represented by formula (5-3). COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition useful as a chemically amplified resist excellent in basic physical properties as a resist as well as in exposure window. SOLUTION: The radiation sensitive resin composition comprises (A) an alkali-insoluble or hardly alkali-soluble acid-dissociating group-containing resin which becomes alkali-soluble by dissociation of the acid-dissociating group, (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation of ≤220 nm wavelength and (C) a phenolic compound represented by formula (C-1). COPYRIGHT: (C)2004,JPO