BINDER COMPOSITION FOR SELF-CURING MOLD FORMATION

    公开(公告)号:MY163382A

    公开(公告)日:2017-09-15

    申请号:MYPI2012002902

    申请日:2010-12-17

    Applicant: KAO CORP

    Abstract: A BINDER COMPOSITION FOR SELF-CURING MOLD FORMATION, COMPRISING AT LEAST ONE CONDENSATE (A) SELECTED FROM FURFURYL ALCOHOL CONDENSATE AND FURFURYL ALCOHOL/FORMALDEHYDE CONDENSATE, AND AN ACID-CURABLE RESIN (B), WHEREIN ABOUT THE CONDENSATE (S).(A), THE PRESENCE RATIO BY MOLE OF ITS/THEIR FURAN RINGS (A) TO THE TOTAL OF ITS/THEIR METHYL GROUPS (B), METHYLENE GROUPS (C) AND OX METHYLENE GROUPS (D), A : (B + C + D), IS FROM 1 :1.00 TO 1 : 1.08, AND THE CONTENT BY PERCENTAGE OF THE AT LEAST ONE CONDENSATE (A) IS FROM 0.3 TO 8.0% BY WEIGHT.

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