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公开(公告)号:DE69317801T2
公开(公告)日:1998-07-30
申请号:DE69317801
申请日:1993-01-29
Applicant: KAO CORP
Inventor: ODAJIMA SHINGO , OHTANI SHOJI , OSAWA TETSUHIRO , TAKITA MASANORI , NAKANO YUKIHIRO
IPC: B29C49/00 , B29C49/06 , B29C49/22 , B29C70/58 , B29C70/60 , B29C70/62 , B65D1/02 , C08L67/02 , C08J5/18
Abstract: A plastic molding produced by molding a resin composition comprising 98 to 50 parts by weight of a thermoplastic polyester resin (A) and 2 to 50 parts by weight of a resin (B) incompatible with the thermoplastic polyester resin (A), the resin (B) being dispersed in the resin (A), wherein the resin (B) has in an arbitrary layer in the direction of the thickness of the plastic molding a substantially rodlike form satisfying the requirement represented by the following formulae (1) and (2) and is oriented in parallel to the outer surface of the plastic molding and in the direction of flow of the resin composition in molding: 1 (P + Q)/L wherein L, P and Q represent the size of the particle of said resin (B) and respectively have the following values: L: the average length ( mu m) in the direction of stretching of the particle; P: the average major axis ( mu m) in the case where a section perpendicular to the direction of stretching of the particle is approximated to be elliptical; and Q: the average minor axis ( mu m) in the case where the section perpendicular to the direction of stretching of the particle is approximated to be elliptical.
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公开(公告)号:DE19707034A1
公开(公告)日:1997-08-28
申请号:DE19707034
申请日:1997-02-21
Applicant: KAO CORP
Inventor: ODAJIMA SHINGO , OSAWA TETSUHIRO , OHTANI SHOJI
IPC: B65B61/02 , B29C49/04 , B29C49/06 , B29C49/24 , B31D1/02 , B32B27/32 , C09D123/06 , G09F3/04 , B29C45/14 , B65C9/25 , B65C9/46 , C09J123/08
Abstract: A heat-activated label is provided having a substrate and an adhesive layer provided on the back side of the substrate, in which an adhesive used in the adhesive layer contains an ethylene-* small Greek alpha *-olefin copolymer obtained by copolymerization of ethylene and an * small Greek alpha *-olefin in the presence of a metallocene compound-containing catalyst. The label (1) may be stuck to a previously moulded article (11) or a moulded article may be produced in which the label is in the mould 23.
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公开(公告)号:DE3883072T2
公开(公告)日:1993-12-02
申请号:DE3883072
申请日:1988-05-11
Applicant: KAO CORP
Inventor: OHTANI SHOJI , MUROI YOSHIYUKI , TSUSHIMA RIKIO
IPC: C08F2/08 , C08F210/00 , C08F210/10 , C08F220/04 , C08F222/06
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公开(公告)号:DE3883072D1
公开(公告)日:1993-09-16
申请号:DE3883072
申请日:1988-05-11
Applicant: KAO CORP
Inventor: OHTANI SHOJI , MUROI YOSHIYUKI , TSUSHIMA RIKIO
IPC: C08F2/08 , C08F210/00 , C08F210/10 , C08F220/04 , C08F222/06
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公开(公告)号:NO170425B
公开(公告)日:1992-07-06
申请号:NO882255
申请日:1988-05-24
Applicant: KAO CORP
Inventor: OHTANI SHOJI , MUROI YOSHIYUKI , TSUSHIMA RIKIO
IPC: C08F2/08 , C08F210/00 , C08F210/10 , C08F220/04 , C08F222/06
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公开(公告)号:GB2181140B
公开(公告)日:1989-06-28
申请号:GB8624298
申请日:1986-04-04
Applicant: KAO CORP
Inventor: OHTANI SHOJI , HOSOKAWA YASUNORI , YASUDA YUTAKA
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公开(公告)号:NO882255L
公开(公告)日:1988-11-28
申请号:NO882255
申请日:1988-05-24
Applicant: KAO CORP
Inventor: OHTANI SHOJI , MUROI YOSHIYUKI , TSUSHIMA RIKIO
IPC: C08F2/08 , C08F210/00 , C08F210/10 , C08F220/04 , C08F222/06 , C08F
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公开(公告)号:GB2181140A
公开(公告)日:1987-04-15
申请号:GB8624298
申请日:1986-04-04
Applicant: KAO CORP
Inventor: OHTANI SHOJI , HOSOKAWA YASUNORI , YASUDA YUTAKA
Abstract: Reversed phase suspension polymerization is conducted by adding an aqueous solution of a water-soluble, ethylenically unsaturated monomer to a hydrophobic solvent inert to polymerization in the presence of a dispersant comprising a polymer obtained by addition reaction of alpha -olefin or alkyl vinyl ether to N-vinyl cyclic amide polymer to obtain stable small granules of the polymer.
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公开(公告)号:DE69317801D1
公开(公告)日:1998-05-14
申请号:DE69317801
申请日:1993-01-29
Applicant: KAO CORP
Inventor: ODAJIMA SHINGO , OHTANI SHOJI , OSAWA TETSUHIRO , TAKITA MASANORI , NAKANO YUKIHIRO
IPC: B29C49/00 , B29C49/06 , B29C49/22 , B29C70/58 , B29C70/60 , B29C70/62 , B65D1/02 , C08L67/02 , C08J5/18
Abstract: A plastic molding produced by molding a resin composition comprising 98 to 50 parts by weight of a thermoplastic polyester resin (A) and 2 to 50 parts by weight of a resin (B) incompatible with the thermoplastic polyester resin (A), the resin (B) being dispersed in the resin (A), wherein the resin (B) has in an arbitrary layer in the direction of the thickness of the plastic molding a substantially rodlike form satisfying the requirement represented by the following formulae (1) and (2) and is oriented in parallel to the outer surface of the plastic molding and in the direction of flow of the resin composition in molding: 1 (P + Q)/L wherein L, P and Q represent the size of the particle of said resin (B) and respectively have the following values: L: the average length ( mu m) in the direction of stretching of the particle; P: the average major axis ( mu m) in the case where a section perpendicular to the direction of stretching of the particle is approximated to be elliptical; and Q: the average minor axis ( mu m) in the case where the section perpendicular to the direction of stretching of the particle is approximated to be elliptical.
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公开(公告)号:GB2310398A
公开(公告)日:1997-08-27
申请号:GB9703120
申请日:1997-02-14
Applicant: KAO CORP
Inventor: ODAJIMA SHINGO , OSAWA TETSUHIRO , OHTANI SHOJI
IPC: B65B61/02 , B29C49/04 , B29C49/06 , B29C49/24 , B31D1/02 , B32B27/32 , C09D123/06 , G09F3/04 , C09J123/08 , B32B7/12 , C09J123/16
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