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公开(公告)号:US11127585B2
公开(公告)日:2021-09-21
申请号:US16341533
申请日:2017-11-22
IPC: H01L21/02 , H01L23/00 , H01L29/06 , H01L21/306
Abstract: An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.
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公开(公告)号:US11121392B2
公开(公告)日:2021-09-14
申请号:US16340900
申请日:2017-10-31
IPC: H01J19/08 , H01M8/1286 , H01M4/88 , H01M6/40 , H01M12/08 , H01M8/1097
Abstract: A thin-film electrochemical device includes a monolithic substrate, which includes a cavity enclosed by bottom and side surfaces of the substrate, and a thin-film arranged on a top surface of the substrate and enclosing the cavity. The thin-film is permeable to ions.
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