-
1.发明申请DECAL ELECTRONICS FOR PRINTED HIGH PERFORMANCE CMOS ELECTRONIC SYSTEMS 审中-公开印花高性能CMOS电子系统的DECAL ELECTRONICS
公开(公告)号：WO2017199148A1
公开(公告)日：2017-11-23
申请号：PCT/IB2017/052816
申请日：2017-05-12
IPC: H01L21/48 , H01L23/538
Abstract: High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.
Abstract translation: 高性能互补金属氧化物半导体（CMOS）电子元件对于任何成熟的电子系统都是至关重要的。 然而，最先进的CMOS电子设备刚性大，使其无法用于柔性电子应用。 尽管存在用于弯曲它们的散装材料减少方法，但是这种减薄的CMOS电子器件易碎并且容易受到高吞吐量制造的处理。 在这里，我们展示了用于柔性CMOS电子器件的CMOS技术兼容制造工艺的融合，其中基于喷墨和导电纤维素的互连，随后是增材制造（即，基于3D打印的封装）以及最终卷对卷印刷封装贴花电子器件 基于薄膜晶体管的电路元件和传感器），专注于印刷高性能柔性电子系统。 这项工作为包装灵活的电子系统提供了最实用的途径，适用于广泛的应用。
-
Search Results
2
records
(took 0.032 seconds)
