Abstract:
A method for synchronizing sample stage motion with a time delay integration (TDI) charge-couple device (CCD) in a semiconductor inspection tool, including: measuring a lateral position of a stage holding a sample being inspected; measuring a vertical position of the stage; determining a corrected lateral position of an imaged pixel of the sample based on the measured lateral and vertical positions; and synchronizing charge transfer of the TDI CCD with the corrected lateral position of the imaged pixel.
Abstract:
Optical inspection methods and apparatus for high-resolution photomasks using only a test image. A filter is applied to an image signal received from radiation that is transmitted by or reflected from a photomask having a test image. The filter may be implemented using programmed control to adjust and control filter conditions, illumination conditions, and magnification conditions.
Abstract:
An extreme ultraviolet (EUM) mask inspection system, comprising a light source to project EUV light along an optical axis, an illumination system to receive the EUV light from the source, the illumination system comprising a spectral purity filter (SPF), the SPF transmits a first portion of the EUV light along the optical axis toward a mask and the SPF comprising a plurality of at least partially reflective elements, said elements reflects a second portion of the EUV light off the optical axis, a projection system adapted to receive the first portion of the EUV light after it has illuminated the mask, a first detector array adapted to receive the image, and a second detector array to receive the second portion of the EUV light. The SPF may comprise one or more multilayer interference-type filters. Alternatively, the SPF comprises a thin film filter disposed on a grazing incidence mirror array.
Abstract:
Methods for detecting and classifying defects on a reticle are provided. One method includes acquiring images of the reticle at first and second conditions during inspection of the reticle. The first condition is different than the second condition. The method also includes detecting the defects on the reticle using one or more of the images acquired at the first condition. In addition, the method includes classifying an importance of the defects detected on the reticle using one or more of the images acquired at the second condition. The detecting and classifying steps are performed substantially simultaneously during the inspection.
Abstract:
A method for synchronizing sample stage motion with a time delay integration (TDI) charge-couple device (CCD) in a semiconductor inspection tool, including: measuring a lateral position of a stage holding a sample being inspected; measuring a vertical position of the stage; determining a corrected lateral position of an imaged pixel of the sample based on the measured lateral and vertical positions; and synchronizing charge transfer of the TDI CCD with the corrected lateral position of the imaged pixel.
Abstract:
An extreme ultraviolet (EUM) mask inspection system, comprising a light source to project EUV light along an optical axis, an illumination system to receive the EUV light from the source, the illumination system comprising a spectral purity filter (SPF), the SPF transmits a first portion of the EUV light along the optical axis toward a mask and the SPF comprising a plurality of at least partially reflective elements, said elements reflects a second portion of the EUV light off the optical axis, a projection system adapted to receive the first portion of the EUV light after it has illuminated the mask, a first detector array adapted to receive the image, and a second detector array to receive the second portion of the EUV light. The SPF may comprise one or more multilayer interference-type filters. Alternatively, the SPF comprises a thin film filter disposed on a grazing incidence mirror array.