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公开(公告)号:US11862522B2
公开(公告)日:2024-01-02
申请号:US17179379
申请日:2021-02-18
Applicant: KLA-Tencor Corporation
Inventor: Barak Bringoltz , Evgeni Gurevich , Ido Adam , Yoel Feler , Dror Alumot , Yuval Lamhot , Noga Sella , Yaron De Leeuw , Tal Yaziv , Eltsafon Ashwal-Island , Lilach Saltoun , Tom Leviant
CPC classification number: H01L22/20 , G03F7/70633 , G03F9/7003 , H01L22/12
Abstract: Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing of aggregated measurements, noise reduction, cluster analysis, detailed analysis of the landscape and targets with skewed cells are employed separately or in combination to provide cumulative improvements of measurement accuracy.
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公开(公告)号:US20190004438A1
公开(公告)日:2019-01-03
申请号:US16102424
申请日:2018-08-13
Applicant: KLA-Tencor Corporation
Inventor: Eran Amit , Daniel Kandel , Dror Alumot , Amit Shaked , Liran Yerushalmi
Abstract: An overlay metrology system includes one or more processors coupled to an illumination source to direct illumination to a sample and a detector to capture diffracted orders of radiation from the sample. The system may generate overlay sensitivity calibration parameters based on differential measurements of a calibration target including two overlay target cells on the sample, where first-layer target elements and second-layer target elements of the overlay target cells are distributed with a common pitch along a measurement direction and are misregistered with a selected offset value in opposite directions. The system may further determine overlay measurements based on differential measurements of additional overlay target cells with two wavelengths, where first-layer target elements and second-layer target elements of the additional overlay target cells are distributed with the common pitch and are formed to overlap symmetrically. The system may further adjust the overlay measurements with the overlay sensitivity calibration parameters.
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公开(公告)号:US20160266505A1
公开(公告)日:2016-09-15
申请号:US15159009
申请日:2016-05-19
Applicant: KLA-Tencor Corporation
Inventor: Eran Amit , Daniel Kandel , Dror Alumot , Amit Shaked , Liran Yerushalmi
IPC: G03F9/00
CPC classification number: G03F7/70633 , H01L22/12 , H01L27/0207 , H01L27/092
Abstract: Metrology methods and targets are provided, that expand metrological procedures beyond current technologies into multi-layered targets, quasi-periodic targets and device-like targets, without having to introduce offsets along the critical direction of the device design. Several models are disclosed for deriving metrology data such as overlays from multi-layered target and corresponding configurations of targets are provided to enable such measurements. Quasi-periodic targets which are based on device patterns are shown to improve the similarity between target and device designs, and the filling of the surroundings of targets and target elements with patterns which are based on device patterns improve process compatibility. Offsets are introduced only in non-critical direction and/or sensitivity is calibrated to enable, together with the solutions for multi-layer measurements and quasi-periodic target measurements, direct device optical metrology measurements.
Abstract translation: 提供了计量方法和目标,将计量过程超越现有技术扩展到多层目标,准周期目标和设备样目标,而不必沿着设备设计的关键方向引入偏移量。 公开了用于导出诸如来自多层目标的覆盖层的度量数据的几个模型,并且提供了相应的目标配置以实现这种测量。 显示基于设备模式的准周期性目标,以改善目标和设备设计之间的相似性,并且使用基于设备模式的模式来填充目标和目标元素的环境,从而提高了流程兼容性。 偏移仅在非关键方向引入,和/或灵敏度被校准,以便与多层测量和准周期性目标测量的解决方案一起使用直接设备光学测量测量。
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公开(公告)号:US20210175132A1
公开(公告)日:2021-06-10
申请号:US17179379
申请日:2021-02-18
Applicant: KLA-Tencor Corporation
Inventor: Barak Bringoltz , Evgeni Gurevich , Ido Adam , Yoel Feler , Dror Alumot , Yuval Lamhot , Noga Sella , Yaron De Leeuw , Tal Yaziv , Eltsafon Ashwal-Island , Lilach Saltoun , Tom Leviant
Abstract: Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing of aggregated measurements, noise reduction, cluster analysis, detailed analysis of the landscape and targets with skewed cells are employed separately or in combination to provide cumulative improvements of measurement accuracy.
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公开(公告)号:US20180253017A1
公开(公告)日:2018-09-06
申请号:US15867485
申请日:2018-01-10
Applicant: KLA-Tencor Corporation
Inventor: Michael E. Adel , Amnon Manassen , William Pierson , Ady Levy , Pradeep Subrahmanyan , Liran Yerushalmi , DongSub Choi , Hoyoung Heo , Dror Alumot , John Charles Robinson
IPC: G03F7/20
CPC classification number: G03F7/70633 , G03F7/705 , G03F7/70508 , G03F7/7085
Abstract: A process control system may include a controller configured to receive after-development inspection (ADI) data after a lithography step for the current layer from an ADI tool, receive after etch inspection (AEI) overlay data after an exposure step of the current layer from an AEI tool, train a non-zero offset predictor with ADI data and AEI overlay data to predict a non-zero offset from input ADI data, generate values of the control parameters of the lithography tool using ADI data and non-zero offsets generated by the non-zero offset predictor, and provide the values of the control parameters to the lithography tool for fabricating the current layer on the at least one production sample.
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公开(公告)号:US20180047646A1
公开(公告)日:2018-02-15
申请号:US15540409
申请日:2017-02-23
Applicant: KLA-Tencor Corporation
Inventor: Barak Bringoltz , Evgeni Gurevich , Ido Adam , Yoel Feler , Dror Alumot , Yuval Lamhot , Noga Sella , Yaron Deleeuw , Tal Yaziv , Eltsafon Ashwal , Lilach Saltoun , Tom Leviant
CPC classification number: H01L22/20 , G03F7/70633 , G03F9/7003 , G06F16/285 , H01L22/12
Abstract: Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing of aggregated measurements, noise reduction, cluster analysis, detailed analysis of the landscape and targets with skewed cells are employed separately or in combination to provide cumulative improvements of measurement accuracy.
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公开(公告)号:US11054752B2
公开(公告)日:2021-07-06
申请号:US16102424
申请日:2018-08-13
Applicant: KLA-Tencor Corporation
Inventor: Eran Amit , Daniel Kandel , Dror Alumot , Amit Shaked , Liran Yerushalmi
IPC: G03F7/20 , H01L21/66 , H01L27/02 , H01L27/092
Abstract: An overlay metrology system includes one or more processors coupled to an illumination source to direct illumination to a sample and a detector to capture diffracted orders of radiation from the sample. The system may generate overlay sensitivity calibration parameters based on differential measurements of a calibration target including two overlay target cells on the sample, where first-layer target elements and second-layer target elements of the overlay target cells are distributed with a common pitch along a measurement direction and are misregistered with a selected offset value in opposite directions. The system may further determine overlay measurements based on differential measurements of additional overlay target cells with two wavelengths, where first-layer target elements and second-layer target elements of the additional overlay target cells are distributed with the common pitch and are formed to overlap symmetrically. The system may further adjust the overlay measurements with the overlay sensitivity calibration parameters.
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公开(公告)号:US10571811B2
公开(公告)日:2020-02-25
申请号:US15159009
申请日:2016-05-19
Applicant: KLA-Tencor Corporation
Inventor: Eran Amit , Daniel Kandel , Dror Alumot , Amit Shaked , Liran Yerushalmi
IPC: G03F7/20 , H01L21/66 , H01L27/02 , H01L27/092
Abstract: Metrology methods and targets are provided, that expand metrological procedures beyond current technologies into multi-layered targets, quasi-periodic targets and device-like targets, without having to introduce offsets along the critical direction of the device design. Several models are disclosed for deriving metrology data such as overlays from multi-layered target and corresponding configurations of targets are provided to enable such measurements. Quasi-periodic targets which are based on device patterns are shown to improve the similarity between target and device designs, and the filling of the surroundings of targets and target elements with patterns which are based on device patterns improve process compatibility. Offsets are introduced only in non-critical direction and/or sensitivity is calibrated to enable, together with the solutions for multi-layer measurements and quasi-periodic target measurements, direct device optical metrology measurements.
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公开(公告)号:US10409171B2
公开(公告)日:2019-09-10
申请号:US15867485
申请日:2018-01-10
Applicant: KLA-Tencor Corporation
Inventor: Michael E. Adel , Amnon Manassen , William Pierson , Ady Levy , Pradeep Subrahmanyan , Liran Yerushalmi , DongSub Choi , Hoyoung Heo , Dror Alumot , John Charles Robinson
Abstract: A process control system may include a controller configured to receive after-development inspection (ADI) data after a lithography step for the current layer from an ADI tool, receive after etch inspection (AEI) overlay data after an exposure step of the current layer from an AEI tool, train a non-zero offset predictor with ADI data and AEI overlay data to predict a non-zero offset from input ADI data, generate values of the control parameters of the lithography tool using ADI data and non-zero offsets generated by the non-zero offset predictor, and provide the values of the control parameters to the lithography tool for fabricating the current layer on the at least one production sample.
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