公开(公告)号：US20180003630A1

公开(公告)日：2018-01-04

申请号：US15650652

申请日：2017-07-14

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Andrew HILL ,  Barry LOEVSKY

IPC: G01N21/47 ,  G03F7/20

CPC classification number: G01N21/4788 ,  G01B2210/48 ,  G01N2201/06113 ,  G03F7/701 ,  G03F7/70633

Abstract: A scatterometry measurement system includes an objective lens with a central obscuration and an illumination source configured to illuminate a scatterometry target through the objective lens with a first illumination beam at a first illumination angle and a second illumination beam at a second illumination angle in which the scatterometry target includes periodic structures located in at least two layers. The objective lens collects at least one diffracted order from the first illumination beam and at least one diffracted order from the second illumination beam such that the at least one diffracted order from the first illumination beam and the at least one diffracted order from the second illumination beam have a non-overlapping distribution in a portion of an imaging pupil plane not blocked by the central obscuration.

公开(公告)号：US10365230B1

公开(公告)日：2019-07-30

申请号：US14661448

申请日：2015-03-18

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Tzahi Grunzweig

IPC: G01N21/956 ,  G01B11/27

Abstract: Metrology methods and modules are provided, which comprise measuring intensity spatial distributions and peaks of spots at the pupil plane of a metrology system that correspond to various diffraction orders scattered from target cells and calculating overlay(s) of the target cell(s) from the measured intensity spatial distributions and peaks. For example, intensity peak or distribution of zeroth diffraction orders from four cells, first diffraction orders from two cells as well as diffraction orders from a single cell may be used to derive an overlay estimation, which may also be compared to standard overlay measurements for different purposes. Intensity spatial distributions may also be used to derive weight function for adjusting measurements or the metrology system.

公开(公告)号：US20180373167A1

公开(公告)日：2018-12-27

申请号：US15576602

申请日：2017-10-24

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Jordan Pio ,  Alexander Svizher

IPC: G03F7/20

Abstract: Scatterometry overlay targets and measurement methods are provided, which are configured to detect and eliminate process-related errors and illumination-related errors from overlay measurements of the targets. Targets comprise at least three cells associated with a measurement direction, wherein at least two of the cells comprise periodic structures at different target layers, having a same pitch and opposite offsets between the two cells, and at least an additional cell comprises a periodic structure with the same pitch at only one of the target layers. The additional cell(s) are used to detect irregularities in the respective periodic structure(s), enable estimation of process quality, provide reference images, enhance metrology simulations and provide mitigation of errors in critical process steps. Measurement methods incorporate scatterometry measurements ion the additional cell(s) for these purposes.

公开(公告)号：US20190122357A1

公开(公告)日：2019-04-25

申请号：US15739381

申请日：2017-10-22

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Nadav Gutman ,  David Gready ,  Mark Ghinovker ,  Vladimir Levinski ,  Claire E. Staniunas ,  Nimrod Shuall ,  Yuri Paskover

IPC: G06T7/00 ,  G06T7/73 ,  G03G15/00

Abstract: Systems and methods are provided, which calculate overlay misregistration error estimations from analyzed measurements of each ROI (region of interest) in at least one metrology imaging target, and incorporate the calculated overlay misregistration error estimations in a corresponding estimation of overlay misregistration. Disclosed embodiments provide a graduated and weighted analysis of target quality which may be integrated in a continuous manner into the metrology measurement processes, and moreover evaluates target quality in terms of overlay misregistration, which forms a common basis for evaluation of errors from different sources, such as characteristics of production steps, measurement parameters and target characteristics. Such common basis then enables any of combining various error sources to give a single number associated with measurement fidelity, analyzing various errors at wafer, lot and process levels, and/or to trade-off the resulting accuracy for throughput by reducing the number of measurements, in a controlled manner.

公开(公告)号：US09851300B1

公开(公告)日：2017-12-26

申请号：US14678411

申请日：2015-04-03

Applicant: KLA-Tencor Corporation

Inventor： Barak Bringoltz ,  Ofer Zaharan ,  Amnon Manassen ,  Nadav Carmel ,  Victoria Naipak ,  Alexander Svizher ,  Tzahi Grunzweig ,  Daniel Kandel

IPC: G01N21/55

CPC classification number: G03F7/70633

Abstract: Methods and metrology modules and tools are provided, which minimize an estimated overlay variation measure at misalignment vector values obtained from a derived functional form of an overlay linear response to non-periodic effects. Provided methods further quantifying target noise due to the non-periodic effects using multiple repeated overlay measurements of the target cells, calculating an ensemble of overlay measurements between the cells over the multiple measurement repeats and expressing the target noise as a statistical derivative of the calculated overlay measurements. Sub-ensembles may be selected to further characterize the target noise. Various outputs include optimized scanning patterns, target noise metrics and recipe and target optimization.

公开(公告)号：US10761022B2

公开(公告)日：2020-09-01

申请号：US15083946

申请日：2016-03-29

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Alexander Svizher

IPC: G01N21/47 ,  G03F7/20 ,  G06F30/39 ,  G01N21/956

Abstract: A scatterometry metrology system, configured to measure diffraction signals from at least one target having respective at least one measurement direction, the scatterometry metrology system having at least one field stop having edges which are slanted with respect to the at least one measurement direction.

公开(公告)号：US10565697B2

公开(公告)日：2020-02-18

申请号：US15739381

申请日：2017-10-22

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Nadav Gutman ,  David Gready ,  Mark Ghinovker ,  Vladimir Levinski ,  Claire E. Staniunas ,  Nimrod Shuall ,  Yuri Paskover

IPC: G06T7/00 ,  G03G15/00 ,  G06T7/73

Abstract: Systems and methods are provided, which calculate overlay misregistration error estimations from analyzed measurements of each ROI (region of interest) in at least one metrology imaging target, and incorporate the calculated overlay misregistration error estimations in a corresponding estimation of overlay misregistration. Disclosed embodiments provide a graduated and weighted analysis of target quality which may be integrated in a continuous manner into the metrology measurement processes, and moreover evaluates target quality in terms of overlay misregistration, which forms a common basis for evaluation of errors from different sources, such as characteristics of production steps, measurement parameters and target characteristics. Such common basis then enables any of combining various error sources to give a single number associated with measurement fidelity, analyzing various errors at wafer, lot and process levels, and/or to trade-off the resulting accuracy for throughput by reducing the number of measurements, in a controlled manner.

公开(公告)号：US10379449B2

公开(公告)日：2019-08-13

申请号：US15760787

申请日：2018-02-07

Applicant: KLA-TENCOR CORPORATION

Inventor： Tzahi Grunzweig ,  Nadav Gutman ,  Claire E. Staniunas ,  Tal Marciano ,  Nimrod Shuall

IPC: G03F7/20 ,  H01L21/66 ,  G01N21/01

Abstract: Systems and method are presented for identifying process variations during manufacture of products such as semiconductor wafers. At a predetermined stage during manufacture of a first products, images of an area of the first product are obtained using different values of at least one imaging parameter. The images are then analyzed to generate a first contrast signature for said first product indicating variations of contrast with said at least one imaging parameter. At the same predetermined stage during manufacture of a second product, images of an area of said second product are obtained corresponding to said area of said first product using different values of said at least one imaging parameter. The images are analyzed to generate a second contrast signature for said second product indicating variations of contrast with said at least one imaging parameter. The first and second contrast signatures are compared to identify whether a variation in process occurred between manufacture of said first and second products.

公开(公告)号：US10209183B2

公开(公告)日：2019-02-19

申请号：US15650652

申请日：2017-07-14

Applicant: KLA-Tencor Corporation

Inventor： Tzahi Grunzweig ,  Andrew Hill ,  Barry Loevsky

IPC: G01N21/47 ,  G03F7/20

Abstract: A scatterometry measurement system includes an objective lens with a central obscuration and an illumination source configured to illuminate a scatterometry target through the objective lens with a first illumination beam at a first illumination angle and a second illumination beam at a second illumination angle in which the scatterometry target includes periodic structures located in at least two layers. The objective lens collects at least one diffracted order from the first illumination beam and at least one diffracted order from the second illumination beam such that the at least one diffracted order from the first illumination beam and the at least one diffracted order from the second illumination beam have a non-overlapping distribution in a portion of an imaging pupil plane not blocked by the central obscuration.

公开(公告)号：US20160290796A1

公开(公告)日：2016-10-06

申请号：US15090389

申请日：2016-04-04

Applicant: KLA-Tencor Corporation

Inventor： Ady Levy ,  Daniel Kandel ,  Michael E. Adel ,  Leonid Poslavsky ,  John Robinson ,  Tal Marciano ,  Barak Bringoltz ,  Tzahi Grunzweig ,  Dana Klein ,  Tal Itzkovich ,  Nadav Carmel ,  Nuriel Amir ,  Vidya Ramanathan ,  Janay Camp ,  Mark Wagner

IPC: G01B11/27 ,  G01N21/21

CPC classification number: G01B11/272 ,  G01N21/211 ,  G01N21/31 ,  G01N21/41 ,  G01N21/4738 ,  G01N21/4788 ,  G01N21/6489 ,  G01N21/9501 ,  G01N2021/213 ,  G03F7/705 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70616

Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.

Abstract translation: 计量性能分析系统包括包括一个或多个检测器的计量工具和通信地耦合到所述一个或多个检测器的控制器。 所述控制器被配置为从所述计量工具接收与度量目标相关联的一个或多个度量数据集，其中所述一个或多个测量数据集包括一个或多个测量的度量度量，并且所述一个或多个测量的度量度量指示与标称值的偏差 。 控制器还被配置为确定与标称值和一个或多个所选择的半导体工艺变化的偏差之间的关系，并且基于一个或多个测量值的值之间的关系确定偏离标称值的一个或多个根本原因 度量和一个或多个所选择的半导体工艺变化。