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公开(公告)号:CH622290A5
公开(公告)日:1981-03-31
申请号:CH1390875
申请日:1975-10-27
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
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公开(公告)号:AU5673073A
公开(公告)日:1974-12-12
申请号:AU5673073
申请日:1973-06-08
Applicant: KOLLMORGEN CORP
Inventor: POLICHETTE JOSEPH , LEECH EDWARD J , CHARM RICHARD W , NUZZI FRANCIS JOSEPH
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公开(公告)号:CA1066961A
公开(公告)日:1979-11-27
申请号:CA225949
申请日:1975-04-30
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
Abstract: .- Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit. on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.
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公开(公告)号:CA1058457A
公开(公告)日:1979-07-17
申请号:CA209561
申请日:1974-09-19
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
Abstract: .- Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the element(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.
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公开(公告)号:CA1052056A
公开(公告)日:1979-04-10
申请号:CA225951
申请日:1975-04-30
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
Abstract: There are provided compositions useful for the sensitization of non-metallic surfaces to the electroless deposition of metal from solution, the compositions comprising cuprous ions and cupric ions resulting from the admixture of a polar liquid medium, an acid, a halogen-containing compound and at least one member selected from the group consisting of a cuprous compound and a cupric compound. The sensitizing compositions represent an advance in the state of the art in that they can be rinsed with water without the need for drying beforehand, and upon rinsing form highly adherent derivatives which are anchored firmly to the surface.
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公开(公告)号:AU7363174A
公开(公告)日:1976-04-01
申请号:AU7363174
申请日:1974-09-24
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , CHARM RICHARD W , POLICHETTE JOSEPH , LEECH EDWARD J
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公开(公告)号:AU7921375A
公开(公告)日:1976-09-23
申请号:AU7921375
申请日:1975-03-18
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
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公开(公告)号:AU7921275A
公开(公告)日:1976-09-23
申请号:AU7921275
申请日:1975-03-18
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
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公开(公告)号:DE2335497A1
公开(公告)日:1974-02-07
申请号:DE2335497
申请日:1973-07-10
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
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公开(公告)号:CA1055327A
公开(公告)日:1979-05-15
申请号:CA209600
申请日:1974-09-19
Applicant: KOLLMORGEN CORP
Inventor: NUZZI FRANCIS J , LEECH EDWARD J , CHARM RICHARD W , POLICHETTE JOSEPH
Abstract: .- The walls of holes in nonmatallic articles are sensitized for deposition of metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the walls in situ the element(s) and/or compound(s); thereafter treating the walls with at least one second medium to decrease the solubility of the compound or combination of compounds and simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the walls with one or more separate reducing agents to transfer said element(s) into a catalyticallyactive state.
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