公开(公告)号：AU8632875A

公开(公告)日：1977-05-12

申请号：AU8632875

申请日：1975-11-05

Applicant: KOLLMORGEN CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  BRANIGAN JOHN G ,  HAMMOND JOSEPH P

IPC: C08J7/14 ,  C08J7/12 ,  C23C18/22 ,  H05K3/00 ,  B05D3/10 ,  B08B9/02

公开(公告)号：DE2550598A1

公开(公告)日：1976-05-13

申请号：DE2550598

申请日：1975-11-07

Applicant: KOLLMORGEN CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  BRANIGAN JOHN G ,  HAMMOND JOSEPH P

IPC: C08J7/14 ,  C08J7/12 ,  C23C18/22 ,  H05K3/00 ,  H05K3/26 ,  H05K3/18

公开(公告)号：GB2235095B

公开(公告)日：1993-07-07

申请号：GB9013681

申请日：1990-06-19

Applicant: KOLLMORGEN CORP ,  ADVANCED INTERCONNECTION TECH

Inventor： HAMMOND JOSEPH P ,  BRANIGAN JOHN

IPC: H05K13/06 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06

Abstract: The invention concerns an interconnection board for connecting electonic, electro-optical and/or optical devices and methods of manufacturing such boards. The interconnections are formed by scribing electrically or optically conductive filaments to form a signal conductor layer. The interconnection board comprises a base as a support member, an signal conductor layer laminated to the base and a surface conductor layer laminated to the signal conductor layer. The interlayer connections between the signal conductor layer and the surface conductor layer are formed by segments of the conductive filaments of the signal conductor layer displaced from the signal conductor layer to the vicinity of surface of the interconnection board to form part of or connect with the surface conductive pattern.

公开(公告)号：GB2235095A

公开(公告)日：1991-02-20

申请号：GB9013681

申请日：1990-06-19

Applicant: KOLLMORGEN CORP

Inventor： HAMMOND JOSEPH P ,  BRANIGAN JOHN

IPC: H05K13/06 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06

Abstract: The invention concerns an interconnection board for connecting electronic, electro-optical and/or optical devices and methods of manufacturing such boards. The interconnections are formed by scribing electrically or optically conductive filaments (22) to form a signal conductor layer. The interconnection board comprises a base (30) as a support member, a signal conductor layer (22) laminated to the base and a surface conductor layer (12, 14) laminated to the signal conductor layer. The interlayer connections between the signal conductor layer and the surface conductor layer are formed by segments (24) of the conductive filaments of the signal conductor layer displaced from the signal conductor layer to the vicinity of the surface of the interconnection board to form part of, or connect with, the surface conductive pattern (12, 14).

公开(公告)号：CH619823A5

公开(公告)日：1980-10-15

申请号：CH1435375

申请日：1975-11-06

Applicant: KOLLMORGEN CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  BRANIGAN JOHN G ,  HAMMOND JOSEPH P

IPC: C08J7/14 ,  C08J7/12 ,  C23C18/22 ,  H05K3/00 ,  H05K3/42