公开(公告)号：US3650777A

公开(公告)日：1972-03-21

申请号：US3650777D

申请日：1971-02-11

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  ZEBLISKY RUDOLPH J ,  MCCORMACK JOHN F ,  WILLIAMSON JOHN DUFF

IPC: C23C18/40 ,  C23C3/02

CPC classification number: C23C18/40

Abstract: An improved aqueous autocatalytic copper deposition solution is provided which comprises maintaining in a solution, containing complexing and reducing agents for the copper ion and a pH adjuster, a small effective amount of a compound providing a metal value selected from the group consisting of molybdenum, niobium, tungsten, rhenium, rare earths of the actinide series, rare earths of the lanthanide series, and mixtures of the foregoing. Additionally, an improved method of depositing electroless copper is provided which comprises employing the solution hereinabove defined.

Abstract translation: 提供了一种改进的水性自催化铜沉积溶液，其包括保持在含有铜离子的络合和还原剂和pH调节剂的溶液中，小的有效量的提供选自钼，铌的金属值的化合物 ，钨，铼，锕系稀土，镧系稀土，以及上述的混合物。 另外，提供了一种沉积无电解铜的改进方法，其包括采用上文所述的溶液。

公开(公告)号：FR2609806A1

公开(公告)日：1988-07-22

申请号：FR8715091

申请日：1987-10-30

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN K ,  PAUNOVIC MILAN ,  CHRISTIAN STEPHEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48 ,  G01N27/50 ,  C25D21/14 ,  H05K3/18

Abstract: A method for analyzing and controlling an electroless plating bath solution is claimed, said method allowing analysis and control of the bath constituents without taking samples, directly within the working solution and without time delay. Analysis and control are performed fully automatical.

公开(公告)号：DE2307222A1

公开(公告)日：1973-09-06

申请号：DE2307222

申请日：1973-02-12

Applicant: KOLLMORGEN CORP

Inventor： LEECH EDWARD J ,  MCCORMACK JOHN F ,  SCHNEBLE JIN FREDERICK W ,  ZEBLISKY RUDOLPH J

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C18/26 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

公开(公告)号：AU602041B2

公开(公告)日：1990-09-27

申请号：AU8326987

申请日：1987-10-30

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN ,  PAUNOVIC MILAN ,  CHRISTIAN STEVEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48 ,  C23C18/54

Abstract: A method for analyzing and controlling an electroless plating bath solution is claimed, said method allowing analysis and control of the bath constituents without taking samples, directly within the working solution and without time delay. Analysis and control are performed fully automatical.

公开(公告)号：GB2207249B

公开(公告)日：1991-03-27

申请号：GB8725399

申请日：1987-10-29

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN K ,  PAUNOVIC MILAN ,  CHRISTIAN STEPHEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48

Abstract: A method for analyzing and controlling an electroless plating bath solution is claimed, said method allowing analysis and control of the bath constituents without taking samples, directly within the working solution and without time delay. Analysis and control are performed fully automatical.

公开(公告)号：CA1265710A

公开(公告)日：1990-02-13

申请号：CA550806

申请日：1987-11-02

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN K ,  PAUNOVIC MILAN ,  CHRISTIAN STEPHEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48 ,  G01N27/42

Abstract: There is disclosed a method for analyzing an electroless plating solution which comprises metallic ions and reducing agent for the metallic ion, the method comprising providing at least two electrodes in the plating solution, electrochemically analyzing at least one constituent of the plating solution using the electrodes, and providing a reproducible surface on at least one of the electrodes after the analysis by electrochemically stripping and resurfacing in the plating solution in order to prepare for the next analysis cycle.

公开(公告)号：SE7016675A0

公开(公告)日：1971-10-21

申请号：SE7016675

申请日：1970-12-19

Applicant: PHOTOCIRCUITS DIV OF KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W ,  MCCORMACK JOHN F ,  RAU THOMAS A

IPC: C23C18/42 ,  C23C18/44

公开(公告)号：FR2609806B1

公开(公告)日：1993-09-10

申请号：FR8715091

申请日：1987-10-30

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN K ,  PAUNOVIC MILAN ,  CHRISTIAN STEPHEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48 ,  G01N27/50 ,  C25D21/14 ,  H05K3/18

Abstract: A method for analyzing and controlling an electroless plating bath solution is claimed, said method allowing analysis and control of the bath constituents without taking samples, directly within the working solution and without time delay. Analysis and control are performed fully automatical.

公开(公告)号：GB2207249A

公开(公告)日：1989-01-25

申请号：GB8725399

申请日：1987-10-29

Applicant: KOLLMORGEN CORP

Inventor： DUFFY JOHN K ,  PAUNOVIC MILAN ,  CHRISTIAN STEPHEN M ,  MCCORMACK JOHN F

IPC: C23C18/34 ,  C23C18/16 ,  C23C18/36 ,  C23C18/40 ,  C23C18/50 ,  G01N27/48 ,  G01N27/38 ,  G01N27/46 ,  G05D21/02

Abstract: A method for analyzing and controlling an electroless plating bath solution is claimed, said method allowing analysis and control of the bath constituents without taking samples, directly within the working solution and without time delay. Analysis and control are performed fully automatical.

公开(公告)号：CH606205A5

公开(公告)日：1978-10-31

申请号：CH191073

申请日：1973-02-09

Applicant: KOLLMORGEN CORP

Inventor： LEECH EDWARD J ,  MCCORMACK JOHN F ,  SCHNEBLE FREDERICK W JR ,  ZEBLISKY RUDOLPH J

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C18/26 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  H05K3/18 ,  H05K3/38 ,  C08J7/06 ,  C25D5/56 ,  H05K3/00