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    Sensitized substrates for chemical metallization
    1.
    发明授权
    Sensitized substrates for chemical metallization 失效
    用于化学金属化的敏化基材

    公开(公告)号：US3925578A

    公开(公告)日：1975-12-09

    申请号：US38758673

    申请日：1973-08-13

    Applicant: KOLLMORGEN PHOTOCIRCUITS

    Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  NUZZI FRANCIS J

    IPC: C23C18/16 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  B44D1/14 ,  B44D1/18

    CPC classification number: C23C18/26 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1831 ,  H05K3/181 ,  H05K3/182 ,  H05K3/185 ,  H05K3/381 ,  H05K3/387 ,  H05K2203/0783 ,  H05K2203/122

    Abstract: There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

    Abstract translation: 提供了适用于生产印刷电路，表盘，铭牌，金属化塑料，玻璃，陶瓷等金属化体的新制造品，其中包括涂覆有铜，镍，钴或铁盐层的基体 或盐组合物，其在暴露于辐射能（例如热，光等）或化学还原剂的情况下被转化为不导电但能够催化金属沉积在金属上的金属核层 从与金属核接触的无电金属沉积溶液的基底。

    6.
    发明专利
    未知

    公开(公告)号：DE2238004A1

    公开(公告)日：1973-02-08

    申请号：DE2238004

    申请日：1972-07-28

    Applicant: KOLLMORGEN PHOTOCIRCUITS

    Inventor： POLICHETTE JOSEPH ,  NUZZI FRANCIS

    IPC: C23C18/16 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

    Abstract: There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

    7.
    发明专利
    未知

    公开(公告)号：DE2265194A1

    公开(公告)日：1976-09-09

    申请号：DE2265194

    申请日：1972-07-28

    Applicant: KOLLMORGEN PHOTOCIRCUITS

    Inventor： POLICHETTE JOSEPH ,  NUZZI FRANCIS J

    IPC: C23C18/16 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

    Abstract: There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

    METHOD FOR THE PRODUCTION OF RADIANT ENERGY IMAGED PRINTED CIRCUIT BOARDS
    9.
    发明专利
    METHOD FOR THE PRODUCTION OF RADIANT ENERGY IMAGED PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：CA954980A

    公开(公告)日：1974-09-17

    申请号：CA146046

    申请日：1972-06-29

    Applicant: KOLLMORGEN PHOTOCIRCUITS

    Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J

    IPC: C23C18/16 ,  C23C18/28 ,  G03C1/64 ,  G03C1/695 ,  G03C1/73 ,  G03C5/58 ,  G03F7/04 ,  H05K3/18 ,  H05K3/42

    Abstract: 1394869 Printed circuits KOLLMORGEN CORP 28 July 1972 [29 July 1971 11 Feb 1972] 35322/72 Heading H1R [Also in Division G2] A process for making printed circuit boards comprising imagewise exposing a material comprising an electrically insulating support carrying a polymer-free layer of (a) a reducible salt of a non-noble metal, (b) a light-sensitive compound which either alone or in combination with (c) acts as a reducing agent for (a) on exposure and (c) a secondary reducer which is incapable of reducing (a) alone, to produce a visible image of metallic nuclei, rinsing to remove remaining metal salts, optionally treating the material with an electroless plating solution to form a deposit to protect the metal nuclei and then treating with an electroless plating bath to form the desired printed circuit. Specified reducible metal salts are copper, nickel, cobalt and iron salts; specified light-sensitive compounds are ferric salts, dichromates, anthraquinones and anthraquinone disulphonic acid and its salts, azides, cinnamic acid and stilbenes and preferred secondary reducers are polyhydric alcoohls, stannous chloride, leuco dyes, aldehydes and glycol ethers. The light-sensitive layer may also contain surfactants and organic acids, e.g. citric, acetic or oxalic acid. The support may be an epoxy or phenolic resin laminate which is coated with a layer of epoxy resin, butadieneacrylonitrile copolymer, phenol/formaldehyde resin and silica and then treated with an oxidant to make it microporous (cf Specification 1,338,491).

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